Results 151 to 160 of about 574,698 (334)

Coplanar waveguide ground potential imbalance as a source of useful signal in near-field scanning microwave microscopy [PDF]

P. A. Gladilovich, A. V. Sabluk, P. S. Burtsev, R. A. Migdisov, Nataliya Maleeva, S. V. Shitov   +5 more
openalex   +1 more source

EBSD Study of Creep‐Induced Lattice Misorientation in MgO‐Particle‐Reinforced Austenitic Steel Composites

Advanced Engineering Materials, EarlyView.
Creep experiments at 900°C on coarse‐grained steel‐ceramic composites containing recycled magnesia reveal that higher ceramic volume fractions significantly enhance the creep resistance. Detailed EBSD investigations identify subgrain formation in the steel matrix as the dominant deformation mechanism.
Moritz Müller, Amaya Compart, Mahnaz Mehdizadehlima, Serhii Yaroshevskyi, Christos G. Aneziris, Horst Biermann, Anja Weidner   +6 more
wiley   +1 more source

Reduction of Oxide Inclusions During the High‐Frequency Welding of Steel via a Nonthermal Ar/H2 Plasma Jet

Advanced Engineering Materials, EarlyView.
High‐frequency (HF) welding of steel is limited by oxide inclusions that degrade weld quality. This study demonstrates, for the first time, the integration of a nonthermal Ar/H2 dielectric barrier discharge (DBD) plasma jet into HF welding. Local plasma treatment provides effective shielding and in‐situ oxide reduction, resulting in markedly fewer and ...
Viktor Udachin, Lienhard Wegewitz, René Gustus, Henning Wiche, Wolfgang Maus‐Friedrichs   +4 more
wiley   +1 more source

Nanoindentation Criteria for Combinatorial Thin Film Libraries

Advanced Engineering Materials, EarlyView.
Thin‐film material libraries are compositional spreads used for screening composition‐structure‐property relationships. Nanoindentation is often used to characterize mechanical behavior across these systems, however variations in methodology are widespread.
Andre Bohn, Adie Alwen, Andrea M. Hodge
wiley   +1 more source

Electrical Conductivities of Conductors, Semiconductors, and Their Mixtures at Elevated Temperatures

Advanced Engineering Materials, EarlyView.
This article presents a comprehensive review of temperature‐dependent electrical conductivity data for multiple material classes at elevated temperatures, highlighting a persistent conductivity gap between metals and semiconductors in the range of 102$\left(10\right)^{2}$– 107$\left(10\right)^{7}$ S/m. Metal–ceramic irregular metamaterials are proposed
Valentina Torres Nieto, Marcia A. Cooper
wiley   +1 more source

Probing Dirac plasmon polaritons in bismuth selenide coupled nano-antennas by terahertz near-field microscopy [PDF]

Chiara Schiattarella, Leonardo Viti, Lucia Sichert, Valentino Pistore, Zhengtianye Wang, Stephanie Law, Oleg Mitrofanov, Miriam S. Vitiello   +7 more
openalex   +1 more source

Near-Field Acoustic Microscopy [PDF]

Europhysics News, 1996
S. Hirsekorn, U. Rabe, W. Arnold
openaire   +1 more source

Thermomechanical Fatigue and Creep–Fatigue Interaction of Inconel 718 Additively Manufactured by Laser Beam Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
Thermomechanical fatigue tests of laser beam powder bed fusion (PBF‐LB) Inconel 718 show that the additively manufactured material reaches almost the lifetimes of conventionally‐rolled material under no‐dwell conditions. Introducing dwell times at the maximum temperature markedly reduces the lifetimes due to pronounced grain boundary sliding associated
Stefan Guth, Tomáš Babinský, Jan Lars Riedel, Wen Hao Kan, Aijun Huang, Martin Heilmaier, Ivo Šulák   +6 more
wiley   +1 more source

Infrared Scattering-Type Scanning Near-Field Optical Microscopy in Water

, 2020
Emanuel Pfitzner, Joachim Heberle
openalex   +2 more sources

Effect of Laser Deoxidation on Adhesive‐Bonded Aluminum in an Oxygen‐Free Atmosphere

Advanced Engineering Materials, EarlyView.
This study investigates laser ablation of aluminum under oxygen‐free conditions. The goal is to produce oxide‐free substrates that enable improved adhesive bonding with epoxy. Optimized laser parameters (90% overlap, 300 µJ) combined with oxide‐free substrates result in the highest tensile strength of the adhesive bond.
Sandra Gerland, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Ludger Overmeyer, Annika Raatz   +5 more
wiley   +1 more source