Results 291 to 300 of about 325,713 (354)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Programmable Dimensional Lithography with Digital Micromirror Devices for Multifunctional Microarchitectures

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores recent advances in digital micromirror device (DMD)‐based lithography, focusing on its programmable light modulation, multi‐material compatibility, and dimensional patterning strategies. It highlights innovations from optical system design to materials integration and multifunctional applications, positioning DMD lithography as a ...
Yubin Lee   +5 more
wiley   +1 more source

Photothermomechanically Efficient, Low‐Cost, High‐Cycle‐Life, Hybrid MXene‐Polymer Actuators

open access: yesAdvanced Materials Technologies, EarlyView.
The addition of MXenes to elastomer‐plastic‐paper films enables the creation of easily prepared actuators that are scalable for small robotic applications. Known as MXene‐polymer Trilayer Actuators (MPTAs), they bend from UV light. Their usefulness is demonstrated through kirigami‐inspired flower‐shaped art design, parallel manipulator for waveguiding,
Ken Iiyoshi   +6 more
wiley   +1 more source

Hospital Financial Health and Provision of Obstetric and Neonatal Intensive Care Unit Services.

open access: yesJAMA Netw Open
Salazar EG   +6 more
europepmc   +1 more source

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