Results 121 to 130 of about 156,270 (343)
Corrosion of food grinding discs in gastro-intestinal environment. [PDF]
Ahmed II +10 more
europepmc +1 more source
Heterophase fcc‐hcp‐fcc RuFeMMnMo (M═CoNi, Co, and Ni) high‐entropy alloy nanomaterials have been successfully synthesized using a one‐pot approach. The highly random distribution of multiple metal components and the tunable diversity of metal atomic arrangements can be realized simultaneously. By combining metals with different work functions, fcc‐hcp‐
Xiang Meng +18 more
wiley +1 more source
Materials and System Design for Self‐Decision Bioelectronic Systems
This review highlights how self‐decision bioelectronic systems integrate sensing, computation, and therapy into autonomous, closed‐loop platforms that continuously monitor and treat diseases, marking a major step toward intelligent, self‐regulating healthcare technologies.
Qiankun Zeng +9 more
wiley +1 more source
Detonation nanodiamonds form a network that entangles silver nanoparticles into stable nanocomplexes. The structure can fine‐tune and enhance plasmonic absorption through nearfield electromagnetic interactions but prevents silver particle aggregation. The study shows how the arrangement and concentration of particles affect light absorption, offering a
Vendula Hrnčířová +4 more
wiley +1 more source
This study proposes a function‐sharing anode design to enable nonmetallic lithium insertion while maintaining intimate interfacial contact with the solid‐state electrolyte. A combination of lithium‐compatible and conformable borohydrides, highly conformable indium metal, less‐graphitized acetylene black, and a layer of highly graphitized massive ...
Keita Kurigami +3 more
wiley +1 more source
Strategy or Necessity? The Determinants of Marriage Between Relatives in the Barcelona Area, Sixteenth-Nineteenth Centuries. [PDF]
Ruíz García J +2 more
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source

