Results 291 to 300 of about 143,877 (400)

Targeting T-Cell Activation for Malaria Immunotherapy: Scoping Review. [PDF]

open access: yesPathogens
Gustifante BN   +4 more
europepmc   +1 more source

Direct Seawater Electrolysis with Stabilized High‐Performance NiCr Anodes

open access: yesAdvanced Materials Interfaces, EarlyView.
An assembly combining a highly active NiFe layered double hydroxyde electrocatalyst and a NiCr foam anode shows high corrosion resistance during alkaline seawater electrolysis (ASE), minimal Cr leaching in the electrolyte, and long‐term efficiency. An electrolyzer comprising the so‐prepared anode and a cathode derivatized with NiMoO4 achieves overall ...
Hiba Saada   +5 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

Progress in Flexible Perovskite Solar Cells: Paving the Way for Scalable Manufacturing

open access: yesAdvanced Materials Technologies, EarlyView.
Perovskite solar cells (PSCs) are well positioned for a successful market uptake. This is due to an unprecedented improvement of their efficiency and stability since the first report in 2009. In this review paper, the building blocks for the scalable manufacturing and future commercialization of flexible PSCs and their pathway to impact will be ...
Dimitar I. Kutsarov   +5 more
wiley   +1 more source

Magnetic Force‐Induced Self‐Assembly and Flip‐Chip Alignment on Electroplated Multilayer Solder with Tailored Melting Points

open access: yesAdvanced Materials Technologies, EarlyView.
This work demonstrates fluidic self‐assembly and self‐alignment of flip‐chips using a magnetic field for agitation and orientation. Pb‐free solder bumps with tailored transformation imprinted melting points enable selective capturing on low‐melting solder in water. After capturing, final alignment is achieved through magnetic forces.
Mahsa Kaltwasser   +3 more
wiley   +1 more source

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