Results 211 to 220 of about 10,757,449 (291)
Prodeg type Shannon graph entropies with closed forms bounds and QSPR modeling. [PDF]
Alsharafi M, Zeren Y.
europepmc +1 more source
Fabrication Routes for Ionic Conducting Fiber Strain Sensors
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw +3 more
wiley +1 more source
Asymptotic Normality and Convergence Rates for Tsallis Entropy Estimators via Stabilization Techniques. [PDF]
Çadırcı MS, Singull M.
europepmc +1 more source
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji +3 more
wiley +1 more source
Bounded cohomology and non-uniform perfection of mapping class groups
identifier:oai:t2r2.star.titech.ac.jp ...
openaire +1 more source
Hierarchically coupled multiscale structure-property correlations in electrodeposited Zn-TiO<sub>2</sub>-graphene oxide nanocomposite coatings. [PDF]
Phogat D +4 more
europepmc +1 more source
Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source
Estimating Mutual Information and Pearson Correlation on Neural Evoked Responses. [PDF]
Hukari A, Cotroneo SF, Salmelin R.
europepmc +1 more source

