Results 161 to 170 of about 22,588 (266)

Looking at Soil as It Is: Evolution of Microscopic Soil Characterization From Kubiëna to Artificial Intelligence

open access: yesJournal of Plant Nutrition and Soil Science, EarlyView.
We provide a historic overview of microscopic soil structure characterization from its founding father, Walter Kubiëna, to several technical revolutions like automation, digitalization, and artificial intelligence. In addition to technical advancements, we explore how concepts and research questions have evolved in time.
Steffen Schlüter   +3 more
wiley   +1 more source

Nondestructive testing of welds

open access: yes, 1999
This article does not have an ...
Baldev Raj,, Subramanian, C. V.
core   +1 more source

Managing Spectral Intensity Variations With In‐Line Fiber‐Optic High‐Volume Noncontact Raman Probes: A Strategy Exploration

open access: yesJournal of Raman Spectroscopy, EarlyView.
Robust quantification in noncontact Raman sensing requires dedicated correction of working distance dependent background effects, while laser power variations are readily stabilized using internal reference signals. Chemically relevant Raman intensity can be preserved for bulk composition measurements, under variable laser power and working distance ...
Tiril Aurora Lintvedt   +3 more
wiley   +1 more source

Development of Pulsed Eddy Current Nondestructive Testing: A Review. [PDF]

open access: yesSensors (Basel)
Huang Q   +8 more
europepmc   +1 more source

Detecting Antibiotic Resistance in Strains of Selected Gram‐Negative Bacterial Species Using Raman Spectroscopy

open access: yesJournal of Raman Spectroscopy, EarlyView.
Raman spectroscopy successfully identified antibiotic‐resistant Gram‐negative strains. Resistant strains of four bacterial species were discriminated from sensitive ones with 99.1% accuracy using PLS regression. The method allows for rapid, label‐free detection of antibiotic resistance.
Fernanda Sant Ana de Siqueira e Oliveira   +3 more
wiley   +1 more source

Evaluation of nondestructive tensile testing

open access: yes, 1971
The results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds are presented. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre ...
Bowe, J. J., Polcari, S. M.
core  

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