Results 161 to 170 of about 22,588 (266)
We provide a historic overview of microscopic soil structure characterization from its founding father, Walter Kubiëna, to several technical revolutions like automation, digitalization, and artificial intelligence. In addition to technical advancements, we explore how concepts and research questions have evolved in time.
Steffen Schlüter +3 more
wiley +1 more source
Nondestructive testing of welds
This article does not have an ...
Baldev Raj,, Subramanian, C. V.
core +1 more source
Flow-Assisted Corrosion and Nondestructive Testing of Multi-Medium Transmission Pipelines: A Review. [PDF]
Cui B +5 more
europepmc +1 more source
Nondestructive testing of native and tissue-engineered medical products: adding numbers to pictures. [PDF]
Castro NJ +3 more
europepmc +1 more source
Robust quantification in noncontact Raman sensing requires dedicated correction of working distance dependent background effects, while laser power variations are readily stabilized using internal reference signals. Chemically relevant Raman intensity can be preserved for bulk composition measurements, under variable laser power and working distance ...
Tiril Aurora Lintvedt +3 more
wiley +1 more source
Development of Pulsed Eddy Current Nondestructive Testing: A Review. [PDF]
Huang Q +8 more
europepmc +1 more source
Correction to: Recent developments in photoacoustic imaging and sensing for nondestructive testing and evaluation. [PDF]
Chen SL, Tian C.
europepmc +1 more source
Raman spectroscopy successfully identified antibiotic‐resistant Gram‐negative strains. Resistant strains of four bacterial species were discriminated from sensitive ones with 99.1% accuracy using PLS regression. The method allows for rapid, label‐free detection of antibiotic resistance.
Fernanda Sant Ana de Siqueira e Oliveira +3 more
wiley +1 more source
Digital Push-Pull Driver Power Supply Topology for Nondestructive Testing. [PDF]
Xiong H, Guo C, Zhao Q, Huang X.
europepmc +1 more source
Evaluation of nondestructive tensile testing
The results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds are presented. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre ...
Bowe, J. J., Polcari, S. M.
core

