Results 141 to 150 of about 571 (183)
Some of the next articles are maybe not open access.
Thermal degradation of epoxy novolac‐phenol formaldehyde novolac resin systems
Journal of Applied Polymer Science, 1991AbstractThe evolution of organic vapors from encapsulants at elevated temperatures has been implicated as the source of the degradation of the gold–aluminum intermetallic of the wire that connects the bond pad to the leadframe in an integrated circuit.
openaire +1 more source
Dual-Cure Propargyl Novolac-Epoxy Resins: Synthesis and Properties
Polymers and Polymer Composites, 2004A partially propargylated oligomeric phenolic novolac (PPN) was synthesised by the Williamson's reaction of a novolac with propargyl bromide and was characterised. Reactive blending of the PPN resin with epoxy resin resulted in a dual cure thermoset.
C.P. Reghunadhan Nair +2 more
openaire +1 more source
Synthesis of high purity o-cresol novolac epoxy resins
2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008O-cresol novolac epoxy resins are used widely as electronic encapsulating materials. When the pitch wires in electronic systems are more slender, there are pressing demands for high purity o-cresol novolac epoxy resin which are with little content of hydrolyzable chloride. In this paper, o-cresol novolac resin was synthesized from para-formaldehyde and
null Xiao-Wei Tian +3 more
openaire +1 more source
Curing and pyrolysis of cresol novolac epoxy resins containing BABODOPN
Polymer Engineering & Science, 2005Abstract This work investigates the curing kinetics, thermal stability, flammability, and decomposition kinetics of cresol novolac epoxy (CNE) cured with two curing agents, [1,4‐bis(3‐aminobenzoyloxy)‐2‐(6‐oxido‐6h‐dibenz(c,e)(1,2) oxaphosphorin‐6‐yl)‐naphthalene] (BABODOPN) and diamino diphenyl methane (DDM). The
S.P. Rwei +3 more
openaire +1 more source
MRS Proceedings, 1986
AbstractImpurities, especially chemically bonded impurities, of o-cresol novolac epoxy resins and their influence on the moisture resistance and other properties of the epoxy molding compounds have been investigated to clarify the influence of impurities of epoxy resins on the reliability of encapsulated semiconductor.
Shuichi Kanagawa, Yutaka Terada
openaire +1 more source
AbstractImpurities, especially chemically bonded impurities, of o-cresol novolac epoxy resins and their influence on the moisture resistance and other properties of the epoxy molding compounds have been investigated to clarify the influence of impurities of epoxy resins on the reliability of encapsulated semiconductor.
Shuichi Kanagawa, Yutaka Terada
openaire +1 more source
Hybrid Polymer Networks of Epoxy Resin and Substituted Phenolic Novolacs
International Journal of Polymeric Materials, 2006Hybrid polymer networks of diglycidyl ether of bisphenol (DGEBA) resin and phenolic novolac resins were prepared and tested for mechanical properties, hardness, and water absorption. The novolacs employed were based on each of phenol and substituted phenols such as p-cresol, t-butyl phenol, and cardanol.
K. P. Unnikrishnan, Eby Thomas Thachil
openaire +1 more source
Toughening of epoxy novolac resin using cardanol based flexibilizers
Journal of Applied Polymer Science, 2015ABSTRACTIn this work, two different cardanol based epoxies (Cardolite NC‐514 and Cardanol NC‐547) were employed as flexibilizers to toughen an epoxy novolac resin namely, poly[(phenylglycidyl ether)‐co‐formaldehyde] (PPGEF). 4,4′‐Diamino‐3,3′‐dimethyl dicyclohexyl methane (BMCHA) was used as a curing agent. Differential scanning calorimetry and dynamic
Rajeshwari S. Gour +2 more
openaire +1 more source
Synthesis of novolac on the basis of bisphenol A as curing agent for epoxy resins
Die Angewandte Makromolekulare Chemie, 1992AbstractBisphenol A novolacs were synthesized in a melting process using paraformaldehyde, and in a solution process using a formalin solution and oxalic acid catalyst. 1H‐NMR investigations show a higher content of methylene bridges in the novolacs synthesized in a melting process. These novolacs were analysed by HPLC, GPC, DSC and FT‐IR spectroscopy.
Veronika Strehmel +4 more
openaire +1 more source
Morphology and Properties of Bisphenol-A Novolac Epoxy Resin with Polysulfone Blends
International Journal of Polymer Analysis and Characterization, 2011Polysulfone (PSF) was blended into bisphenol-A novolac epoxy resin (bis-ANER) diluted with vinyl cyclohexene dioxide (VCD), and the mixture was cured with methylhexahydrophthalic anhydride (MHHPA). The cured bis-ANER/VCD/MHHPA/PSF developed a bi-continuous morphology consisting of two distinct domains: one of the domains is an epoxy-rich matrix ...
Zhao Liu +4 more
openaire +1 more source
Preparation and curing kinetics of bisphenol A type novolac epoxy resins
Journal of Applied Polymer Science, 2005AbstractA bisphenol A type novolac resin (Bis‐ANR) was synthesized from bisphenol A and formaldehyde; the resulting novolac was epoxidized to generate a bisphenol A type novolac epoxy resin (Bis‐ANER). The chemical structures of Bis‐ANR and Bis‐ANER were confirmed by 1H‐NMR spectroscopy and IR spectroscopy; the molecular weights and molecular weight ...
Yanfang Liu +3 more
openaire +1 more source