Results 141 to 150 of about 16,102,303 (245)
An open-source optimization model for sustainable open-pit mine production scheduling. [PDF]
Lotsu JS, Bimpong GY, Boakye K.
europepmc +1 more source
A new circulating accumulation emission model for assessing dust emission from open pit mine. [PDF]
Tang W, Li F.
europepmc +1 more source
This article investigates the dependence of the properties on the manufacturing orientation in the form of the inclination angle to the build plate of LPBF‐fabricated NiTi rods with a diameter of 150–220 µm. Metallographic, chemical, thermal, and mechanical characterization show behavior under identical manufacturing conditions that ranges from ...
Sandra Herzig +2 more
wiley +1 more source
Study on the Intelligent Recognition Algorithm for Open-Pit Mine Slope Fissures: Crack-YOLO with Texture and Semantic Enhancement. [PDF]
Zhao H, Wei H, Liu W, Jia H, He C.
europepmc +1 more source
Distribution Law of the Temperature Inversion Layer in a Deep Open-Pit Mine. [PDF]
Wang Y, Du C.
europepmc +1 more source
Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley +1 more source
Incorporating environmental costs into long-term open-pit mine planning for sustainable resource optimization. [PDF]
Salehi A, Osanloo M, Afraei S.
europepmc +1 more source
Land use classification of open-pit mine based on multi-scale segmentation and random forest model. [PDF]
Yu X, Zhang K, Zhang Y.
europepmc +1 more source
Project of drainage of open pit mine
W pracy omówiono zagadnienia związane z odwadnianiem kopalni odkrywkowych. Zaprezentowano charakterystykę grawitacyjnych systemów odwadniania oraz metody obliczeniowe dopływów wody do wyrobiska odkrywkowego.
Trzop, Filip
core
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source

