Results 221 to 230 of about 19,781,428 (312)

Leveraging Mechanical Resonances for the Selection of Promising Materials in Complex Phase Spaces

open access: yesAdvanced Materials Technologies, EarlyView.
A central challenge in materials science is the design of new functional materials with enhanced performance for targeted applications. This paper demonstrates that “listening” to materials through measuring their mechanical resonances is a rich, and largely untapped, platform for the rapid identification of promising novel compounds and a powerful ...
Christopher A. Mizzi   +4 more
wiley   +1 more source

Ultra‐White Elastomeric Coatings for Daytime Radiative Cooling

open access: yesAdvanced Materials Technologies, EarlyView.
Passive daytime radiative cooling meets elasticity in a new class of ultra‐white silicone coatings. Combining high solar reflectance with strong sky‐window emission, they hold surfaces below ambient temperature under full sunlight while remaining flexible and stretchable. This combination of cooling performance and mechanical flexibility enables energy‐
Abdulrahman Aljwirah   +5 more
wiley   +1 more source

Toward Perception‐Native Electronic Skin: Bio‐Inspired In‐/Near‐Sensor and Neuromorphic Computing for Humanoid Robots

open access: yesAdvanced Materials Technologies, EarlyView.
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim   +6 more
wiley   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

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