Results 101 to 110 of about 42,475 (265)

Supporting AI Readiness Through Digital Workflows in Materials Science

open access: yesAdvanced Engineering Materials, EarlyView.
Digitalization drives innovation in materials science by connecting data silos and turning heterogeneous processes into reusable research pipelines. Across 13 MaterialDigital projects, digital workflows reveal complementary pathways toward AI‐ready materials research, founded on structured data, persistent artifacts, executable orchestration, and ...
Marian Bruns   +67 more
wiley   +1 more source

A Multi‐Scale Machine Learning Framework for the Inverse Design of High Entropy Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
High‐entropy alloys offer vast potential for various applications, including electrocatalysis; however, their compositional complexity challenges conventional screening. We introduce an inverse‐design framework combining two neural networks to determine optimal compositions and reconstruct nanoparticle geometry from targeted properties and conventional
Mikael Takoutsin   +14 more
wiley   +1 more source

Anticorrosive Performance of Smart Epoxy Coatings With Poly(urea‐formaldehyde) Microcapsules Filled With 5‐Ethylidene‐2‐norbornene

open access: yesAdvanced Engineering Materials, EarlyView.
PUF/ENB microcapsules were synthesized based on a sequential factorial design and incorporated into an epoxy matrix. Their anticorrosive action, associated with the self‐healing mechanism, demonstrated that the addition of microcapsules to the coating improved anticorrosive performance compared to pure epoxy coatings, particularly when the encapsulate ...
Vandicleya Alves Moreira   +6 more
wiley   +1 more source

Electrodeposition in Structural Lattices of Variable Architectures

open access: yesAdvanced Engineering Materials, EarlyView.
Electrodeposition enables geometry‐sensitive, autonomous void filling while simultaneously tuning chemical and mechanical properties. The development of approaches that can autonomously fill and heal material voids and yield composites with tailorable properties is increasingly relevant in engineering.
Yeong‐Man Kwon   +3 more
wiley   +1 more source

OSPFv2-Specific Implementation and Functional Validation of RCE-Assisted Fast Reroute Using Custom RCE_BACKUP LSAs

open access: yesIEEE Access
Fast link-failure recovery is critical for delay-sensitive IP services. This paper presents an Open Shortest Path First version 2 (OSPFv2)-specific realization of Repair Computational Element (RCE)-assisted local repair using custom RCE_BACKUP ...
Jozef Papan, Dominik Skvarna
doaj   +1 more source

Less Congested Open Shortest Path First Algorithm for Computer Networks(Arbic) [PDF]

open access: yesAl-Rafidain Engineering Journal (AREJ), 2013
null Dr. ManarYounisKashmola   +1 more
openaire   +1 more source

Thermal Cycle–Microstructure–Property Relationships in Rail Steel Heat‐Affected Zone Simulated by Gleeble

open access: yesAdvanced Engineering Materials, EarlyView.
Microstructural evolution of premium rail steel during flash butt welding (FBW), comparing physically simulated heat‐affected zones with actual weld regions. Thermal cycles induce phase transformations and microstructural heterogeneity that influence weld quality and mechanical performance. These findings provide insights into optimizing FBW parameters
Emmanoelle Cintra da Cunha Araújo   +15 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

open access: yesAdvanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco   +8 more
wiley   +1 more source

Open Shortest Path First- A Case Study

open access: yesIJARCCE, 2017
Vishesh S   +5 more
openaire   +1 more source

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