Results 291 to 300 of about 28,167,232 (365)

Influence of a Standard Heat Treatment on the Microstructure and Properties of Inconel X‐750 Produced by Laser Powder Bed Fusion

open access: yesAdvanced Engineering Materials, EarlyView.
Ni‐base superalloys produced using additive manufacturing (AM) have a different response to heat treatments when compared to their conventional counterparts. Due to such unpredictability, various alloys with industrial interest are currently overlooked in most prior AM research.
Guilherme Maziero Volpato   +6 more
wiley   +1 more source

Graphene–Catechol Dental Sealant: Antibacterial and Mechanical Evaluation

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents dental sealants made with graphene and L‐DOPA‐modified graphene. L‐DOPA enhances graphene dispersion, improving sealant properties. The material shows antibacterial activity against S. mutans and L. casei, along with high strength and elasticity.
Renata Pereira   +6 more
wiley   +1 more source

Development of Aluminum Scandium Alloys for Hydrogen Storage Valves

open access: yesAdvanced Engineering Materials, EarlyView.
Different aluminum alloy series and various aluminum‐scandium alloys with differing Sc and Zr levels are evaluated for use in hydrogen storage valve production. The alloys undergo hardness testing, optical microscopy, and tensile strength analysis, with hardening behavior studied under varying conditions.
Francisco García‐Moreno   +4 more
wiley   +1 more source

Advancing Wildfire‐Retardant Materials: Engineering Strategies for Direct and Indirect Suppression

open access: yesAdvanced Engineering Materials, EarlyView.
Here, the evolution, ecological impact, and performance of current fire‐retardant materials and suppression strategies are reviewed, offering an engineering perspective to address existing challenges and propose pathways for the development of more effective, scalable, and sustainable solutions to meet the demands of a changing climate. Wildfires cause
Changxin Dong   +4 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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