Results 111 to 120 of about 8,145 (310)

Analysis of Optical Integration between Si₃N₄ Waveguide and a Ge-Based Optical Modulator Using a Lateral Amorphous GeSi Taper at the Telecommunication Wavelength of 1.55 µm

Applied Sciences, 2019
We report on the theoretical investigation of using an amorphous Ge0.83Si0.17 lateral taper to enable a low-loss small-footprint optical coupling between a Si3N4 waveguide and a low-voltage Ge-based Franz−Keldysh optical modulator on a bulk Si ...
Worawat Traiwattanapong, Kazumi Wada, Papichaya Chaisakul   +2 more
doaj   +1 more source

Oxygen‐Tunnel Indium Tin Oxide Vertical Channel Transistors with Enhanced Current Density and Reliability for Monolithic 3D Compute‐In‐Memory Systems

Advanced Functional Materials, EarlyView.
Oxygen‐tunnel (OT) indium tin oxide (ITO) vertical channel transistors (VCTs) enable reliable, high‐density gain‐cell memory for monolithic 3D integration. A sandwiched SiN/SiO2/SiN OT stack selectively regulates oxygen transport, suppressing parasitic electrode oxidation while stabilizing channel oxygen vacancies, thereby suppressing carrier injection
Hyeonho Gu, Haksoon Jung, Yongwoo Lee, Hoichang Jeong, Yanfeng Zhao, Heesoo Yang, Minho Park, Hyeonjin Lee, Seunghun Baek, Minju Song, Junghwan Kim, Youngmin Jo, Hyunjin Park, Munhyeon Kim, Jae‐Joon Kim, Kyuho Jason Lee, Byungjo Kim, Jimin Kwon   +17 more
wiley   +1 more source

Demonstration of wafer scale fabrication of 3D stacked transmitter and receiver modules for optical interconnects

, 2013
Optical interconnects can offer small footprint, high bandwidth density and high data rates compared with electrical wires. In this paper, we demonstrate how we use lithographic processes to stack and interconnect opto-electronic ICs on top of their ...
Raz, O Oded, Smalbrugge, B.E., Duan, P., Smalbrugge, BE, Dorren, HJS Harm, Duan, P Pinxiang, Dorren, H.J.S., Raz, O.   +7 more
core   +1 more source

Swelling‐Programmed Topographical Guidance for Dynamic Spheroid Self‐Assembly via a Mechanochemical Hydrogel Niche

Advanced Functional Materials, EarlyView.
A swelling‐programmed micropatterned hydrogel guides adherent cells through a controlled transition from cell–matrix anchoring to cadherin‐mediated cell–cell compaction, enabling rapid assembly of high‐viability spheroids with defined size and morphology.
Han Gyeol Nam, Seon Yeong Chae, Young Woo Kwon, Hye Jin Heo, Hye Rin Lee, Ji Hyeok Lee, Dong‐Wook Han, Yun Hak Kim, Suck Won Hong   +8 more
wiley   +1 more source

50 fJ-per-bit, high speed, directly modulated light sources for on-chip optical data communications

, 2011
By employing optical injection-locking the direct modulation bandwidth of a 10 mu m diameter disc laser is increased to 15GHz.
Raz, O Oded, R. Kumar, Morthier, G Geert, Morthier, G., P. Rojo-Romeo, Rojo-Romeo, P, Raz, O, O. Raz, Regreny, P, Raz, O., H. J. S. Dorren, P. Regreny, Dorren, HJS, Kumar, Rajesh, Regreny, P., Morthier, Geert, Kumar, R., Dorren, HJS Harm, Rojo-Romeo, P., G. Morthier, Dorren, H.J.S.   +20 more
core   +1 more source

Fast Charge–Discharge of LiNi0.9Co0.05Mn0.05 Enabled by a Bikitaite‐Infused Separator for Li Metal Batteries

Advanced Functional Materials, EarlyView.
A bikitaite‐infused cellulose separator is introduced for Li metal batteries, leveraging bikitaite zeolite's ion‐conductive properties to regulate Li+‐ion flux and suppress dendrite growth. The membrane design ensures uniform Li plating, enhanced electrolyte wettability, and robust thermal/mechanical stability, delivering stable performance and low ...
Isheunesu Phiri, Kennedy Ssendagire, Sun‐Yul Ryou   +2 more
wiley   +1 more source

A parallel optical interconnect link with on-chip optical access

, 2004
This paper describes a complete technology family for parallel optical interconnect systems. Key features are the two-dimensional on-chip optical access and the development of a complete optical pathway.
Peter Van Daele, Richard Annen, Van Koetsem, Jan, Meeus, Wim, De Baets, Johan, van den Berg, Eric, Widawski, Gilles, Hannes Lambrecht, Eitel, Sven, Annen, Richard, Lambrecht, Hannes, Ronny Bockstaele, Patrick Le Moine, Klemenc, Michaela, Wim Meeus, Jan Van Koetsem, Rits, Olivier, Olivier Rits, Jacques Goudeau, Michaela Klemenc, Sven Eitel, Reto Fries, Michiel De Wilde, Johan De Baets, Roel Baets, Baets, Roel, Gilles Widawski, Baudouin Bareel, Van Campenhout, Jan, Francois Marion, Julien Routin, Van Daele, Peter, Eric van den Berg, De Wilde, Michiel, Le Moine, Patrick, Straub, Peter, Jan Van Campenhout, Bockstaele, Ronny, Fries, Reto, Marion, François, Peter Straub, Goudeau, Jacques, Routin, Julien, Bareel, Baudouin   +43 more
core   +1 more source

Optical interconnection

III-Vs Review, 2004
AbstractTransceivers based on the XFP Multi Source Agreement (MSA) are making high-speed optical interfaces so simple and cost effective that 10Gbit/s XFP products are becoming the de facto standard in optical access, metro, and long-haul transmission systems and are speeding the convergence of the telecom and datacom infrastructure.
openaire   +1 more source

X‐Functionality–Driven Photocatalytic Hydrogen Evolution in 2D 4‐X‐PEA2SnI4 Perovskites

Advanced Functional Materials, EarlyView.
We report a water‐based synthesis of 2D 4‐X‐PEA2SnI4 perovskite microcrystals with prominent photocatalytic (PC) activity for H2 production. The synergy between organic functionalization and HI‐derived iodide scavenges holes suppress octahedral distortion, and favor electron accumulation, enabling a PC H2 evolution ∼20 µmol·g−1 and long‐term stability ...
Taeyeon Kim, Gayoung Seo, Seong Yeon Park, Juwon Jang, Yunho Ahn, Samiksha Mukesh Jain, Samrat Das Adhikari, Harumi Correa‐Leiva, Ignacio Utreras‐Asenjo, Oscar A. Douglas‐Gallardo, Carina Pareja‐Rivera, Kayoung Cho, Byeongsung Kim, Jhonatan Rodriguez‐Pereira, Eunseo Choi, JaeHong Park, Jin Ho Bang, Danilo H. Jara‐Quinteros, Sixto Giménez, Seog Joon Yoon, Andrés F. Gualdrón‐Reyes, Iván Mora‐Seró   +21 more
wiley   +1 more source

Fully assembled 120Gb/s transceiver chips for high bandwidth density optical interconnects

, 2012
A complete 12X10Gb/s optical interconnect link, consisting of a novel fully assembled 12X10Gb/s transmitter chip and a fully assembled 12X10Gb/s receiver chip, will be shown in the paper.
Raz, O Oded, Duis, J, Duan, P., Smalbrugge, Barry E, Dorren, HJS Harm, Duan, P Pinxiang, Duis, J., Dorren, H.J.S., Raz, O., Smalbrugge, Barry E.   +9 more
core