Results 71 to 80 of about 2,277,534 (295)

AN OPTICAL PACKAGE FOR A RECONFIGURABLE FREE-SPACE OPTICAL INTERCONNECTION NETWORK FOR MULTIPROCESSOR SYSTEMS

, 1995
An optical package for a reconfigurable free-space optical interconnection network based on a novel (2,2,2) switching node for the multiprocessor system is presented.
ZHAO XJ, JUN X, CAO MC HUAZHONG UNIV SCI & TECHNOLNATL LAB LASER TECHNOLWUHAN 430074PEOPLES R CHINA., WU RG, CAO MC, LUO FG, LI HP, GAO WZ   +7 more
core  

VCSEL Light Coupling to a Waveguide to Interconnect XPUs and HBMs on Interposer Chips

Photonics
Multimode VCSELs coupled into waveguides can be a practical path toward realizing commercially viable photonic interposer chips. The experimental coupling of multimode VCSEL light to a non-silicon waveguide fabricated using a CMOS-compatible process is ...
Sahnggi Park, Kyungeun Kim, Hyun-Woo Rhee, Jae-Yong Kim, Namki Kim, Hyunjong Park, Hyo-Hoon Park   +6 more
doaj   +1 more source

Semantic Modeling in Materials Science and Engineering With Platform MaterialDigital Core Ontology 3.0

Advanced Engineering Materials, EarlyView.
The community‐driven Platform MaterialDigital Core Ontology (PMDco) 3.0 is introduced as a Basic Formal Ontology‐aligned semantic backbone for the processing–structure–properties paradigm in Materials Science and Engineering. Modular engineering, automated releases, and validation workflows are highlighted and key semantic patterns for materials ...
Markus Schilling, Philipp von Hartrott, Jörg Waitelonis, Thomas Hanke, Henk Birkholz, Hossein Beygi Nasrabadi, Khashayar Razghandi, Kamilla Zaripova, Felix Thonagel, Fabian Neuhaus, Martin Glauer, Lars Vogt, Harald Sack, Lutz Mädler, Bernd Bayerlein, Chris Eberl   +15 more
wiley   +1 more source

Research on a12-channel optical interconnection subsystem

, 2011
In order to realize the application of the chip-to-chip high speed optical interconnection, the authors of the paper designed a12-channel high density and high speed parallel optical interconnection subsystem, using a vertical-cavity surface-emitting ...
Liu, Bo, Chen, X.(chenxiongbin@semi.ac.cn), Yang, Yu, Chen, Xiongbin, Chen, Hongda   +4 more
core  

A systematic analysis of equivalence in multistage networks [PDF]

, 2002
Many approaches to switching in optoelectronic and optical networks decompose the switching function across multiple stages or hops. This paper addresses the problem of determining whether two multistage or multihop networks are functionally equivalent ...
M. Collier, Collier, Martin
core   +3 more sources

All-optical transparent interconnection of two experimental OFDM-LANs

, 2022
S.99-102The all-optical transparent interconnection of two experimental OFDM-LANs is demonstrated. Fiber amplifiers are used to compensate network losses.
Hermes, T., Schmidt, F., Raub, F., Hilbk, U., Burmeister, M., Meissner, P., Hoen, B., Saniter, J., Bader, G., Westphal, F.-J., Bunning, H., Peters, K., Grossmann, E.   +12 more
core   +1 more source

Integration of OpenCV‐Based Microscopic Adhesive Volume Measurement Into a Pyiron Workflow for Automated Data Analysis

Advanced Engineering Materials, EarlyView.
Residual adhesive after electrode loading in adhesive‐assisted resistance spot welding is quantified through a traceable experimental‐to‐digital workflow. Chromatic confocal topography provides calibrated surface‐height data, while OpenCV detects the electrode imprint and integrates adhesive height into comparable volume metrics.
Sung‐Min Wi, Jiangdong Zhao
wiley   +1 more source

Using a GPS-Aided Inertial System for Coarse-Pointing of Free-Space Optical Communication Terminals [PDF]

, 2006
In the Capanina project, it has been shown that it is possible to use solely GPS positions for coarse-pointing of a stratospheric free-space optical communication terminal.
Bernhard Epple, Epple, Bernhard
core   +1 more source

Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials

Advanced Engineering Materials, EarlyView.
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley   +1 more source

Supporting AI Readiness Through Digital Workflows in Materials Science

Advanced Engineering Materials, EarlyView.
Digitalization drives innovation in materials science by connecting data silos and turning heterogeneous processes into reusable research pipelines. Across 13 MaterialDigital projects, digital workflows reveal complementary pathways toward AI‐ready materials research, founded on structured data, persistent artifacts, executable orchestration, and ...
Marian Bruns, Lateef Abdul, Stephan Barth, Martin Glauer, Manuel Günther, Fabian Neuhaus, Jan‐Ole Perschewski, Thomas Bjarsch, Henrik Abel, Johannes Bosch, Niklas Meyer, Peter Hofmann, Marc Drechsler, Alexander Dyck, Dhanunjaya Kumar Nerella, Marvin Tegeler, Oleg Shchyglo, Ingo Steinbach, Timo Klecker, Henk Birkholz, Ehsan Borzabadi Farahani, Bernard Fedelich, Cetin Haftaoglu, Tarakeshwar Lakshmipathy, Elena Garcia Trelles, Christoph Schweizer, Reza Darvishi Kamachali, Lukas Koschmieder, Janin Eiken, Markus Apel, Sung‐Min Wi, Jiangdong Zhao, Andreas Fezer, Nicolas Christ, Patrick Schneider, Eldor Urinov, Veit Königer, Volker Knoblauch, Janik Harter, Thomas Seifert, Thitichai Janpheng, Florian Fuchs, Fabian Teichert, Jörg Schuster, Anke Bardehle, Andreas Limper, Ulrich Giese, Carlos Lucke, Mario Beiner, Christoph Gögelein, Lisa Leuchtenberger‐Engel, Christian Hopmann, Felix Wentzien, Heike Wittek, Benjamin Klie, Alexander Röhrs, Ludger Overmeyer, Achraf Atila, Marcel Sadowski, Leopold Talirz, Jan Janssen, Jesper R. Pedersen, Peter Beck, Tejs Vegge, Ivano E. Castelli, Wolfgang Wenzel, Tilmann Hickel, Jörg Schaarschmidt   +67 more
wiley   +1 more source