Results 151 to 160 of about 39,226 (228)

Predictive Wafer-Scale Copper Nanowire Fabrication Using Template-Assisted On-Substrate Electrodeposition. [PDF]

Langmuir
Vergin M, Schöttler G, Waag A, Meierhofer F.   +3 more
europepmc   +1 more source

Foundry-enabled wafer-scale characterization and modeling of silicon photonic DWDM links. [PDF]

Nanophotonics
Parsons R, Oh A, Robinson J, Wang S, Cullen M, Jang K, James A, Wang Y, Bergman K.   +8 more
europepmc   +1 more source

A Three-Terminal Si-Ge Avalanche Photodiode with a Breakdown Voltage of 6.8 V and a Gain Bandwidth Product of 1377 GHz. [PDF]

Micromachines (Basel)
Cheng C, Xue J, Yu X, Mu J, Wang B.
europepmc   +1 more source

Advancing glassy carbon microelectrode arrays for neurochemical sensing: impact of double pyrolysis on structure and function. [PDF]

Front Bioeng Biotechnol
Sellen SC, Siwakoti U, Sigdel A, Jaiswal B, Zivanovic S, Castagnola E.   +5 more
europepmc   +1 more source

A 3.584 Tbps coherent receiver chip on InP-LiNbO₃ wafer-level integration platform. [PDF]

Light Sci Appl
Xie X, Wei C, He X, Chen Y, Wang C, Sun J, Jiang L, Ye J, Zou X, Pan W, Yan L.   +10 more
europepmc   +1 more source

Self-Organized Three-Dimensional Optical Circuits and Molecular Layer Deposition for Optical Interconnects, Solar Cells, and Cancer Therapy

, 2012
Tetsuzo Yoshimura
openalex   +2 more sources

Developments and Future Directions in Stretchable Display Technology: Materials, Architectures, and Applications. [PDF]

Micromachines (Basel)
Lim MS, Jeong EG.
europepmc   +1 more source

Optical Interconnection Technologies.

The Journal of The Institute of Electrical Engineers of Japan, 2001
openaire   +2 more sources

Optical Subsystem Interconnections.

The Review of Laser Engineering, 1995
openaire   +2 more sources

Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review. [PDF]

Micromachines (Basel)
Chen G, Wang G, Wang Z, Wang L.
europepmc   +1 more source