Results 141 to 150 of about 104,021 (275)

Wearable Tailored Passive Radiative Cooling Textile for Flexible Electronic Integration

open access: yesAdvanced Science, EarlyView.
A scalable, additive‐free wearable tailored passive radiative cooling textile (WRCT) with hierarchically structured fibers delivers exceptional thermal management, combining >95% solar reflectance, 0.96 mid‐infrared emissivity, and ultralow thermal conductivity (0.041 W/m·K).
Lung Chow   +24 more
wiley   +1 more source

Advances and Perspectives in Graphene‐Based Quantum Dots Enabled Neuromorphic Devices

open access: yesAdvanced Science, EarlyView.
Graphene‐based QDs are zero‐dimensional carbon nanomaterials with pronounced quantum confinement and tunable electronic structures. Herein, we summarize their synthesis strategies and functionalization methods, and highlight their functional roles and operating mechanisms in devices, as well as recent advances in neuromorphic electronics. We anticipate
Yulin Zhen   +9 more
wiley   +1 more source

Arbitrary Orthogonal Polarization Decomposition and Routing With Complex Amplitude Modulation via Wheel‐of‐Fortune‐Inspired Metasurfaces

open access: yesAdvanced Science, EarlyView.
This work demonstrates a receiver‐transmitter‐integrated metasurface that decomposes an incident wave into orthogonal components and routes them into separate channels. Inspired by a “Wheel‐of‐Fortune” mechanism, it enables independent control over the amplitude, phase, and polarization of the transmitted wave.
Tong Liu   +8 more
wiley   +1 more source

Reconfigurable Spoof Plasmonic Skyrmion Electronics for Deformation‐Invariant Multimode Sensing

open access: yesAdvanced Science, EarlyView.
A flexible multimode sensor based on capacitively loaded spoof plasmonic skyrmions enables deformation‐invariant dielectric sensing with ultra‐compact size and high Q‐factor. Near‐equidistant resonances remain stable under shape change and bending, while capacitor loading improves bending robustness and multimode sensitivity, highlighting strong ...
Zengxiang Wang   +7 more
wiley   +1 more source

In Situ Polyurea Integration for Self‐Healing, Durable Transparent Electromagnetic‐Interference Shielding Film

open access: yesAdvanced Science, EarlyView.
A steric‐hindrance molecular engineering strategy uses dimethyl maleate (DMM) to convert poly(1,4‐butanediol) bis(4‐aminobenzoate) (PBDAB) into a precursor with reduced reactivity via Michael addition, thereby retarding the curing process to form a transparent, ultraflexible, and self‐healable secondary‑amine polyurea (PuSA) with a crosslinked network.
Sinan Zheng   +10 more
wiley   +1 more source

Optical wireless communications

open access: yesIET Communications, 2008
R.J. Green, M.S. Leeson
openaire   +1 more source

Multidimensional and Multifunctional Laser‐Induced Graphene (LIG) for Point‐of‐Care and Wearable Biosensing, Theranostics, and Bioactive Interfaces Toward Personalized Healthcare and Regenerative Medicine

open access: yesAdvanced Science, EarlyView.
Multidimensional laser‐induced graphene (LIG) spanning from 0D to 3D architectures is comprehensively reviewed for multifunctional biomedical platforms, including biosensing, theranostics, and bioactive interface applications, which highlights its potentials for point‐of‐care diagnostics, wearable health monitoring, smart drug delivery, and tissue ...
Li Zhang   +3 more
wiley   +1 more source

High‐Power Terahertz Emission from Picosecond Nano‐Plasma Switching Driven by Secondary Electron Emission Avalanche

open access: yesAdvanced Science, EarlyView.
A nano‐plasma device enables watt‐level on‐chip THz generation through picosecond switching triggered by secondary electron emission avalanche. An ultra‐dense electron sheet initiates nano‐plasma formation within a ∼100 nm gap, driving rapid energy release into an integrated resonator.
Guangyu Sun   +4 more
wiley   +1 more source

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

open access: yesAdvanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen   +7 more
wiley   +1 more source

Guest Editorial: Selected papers from the 8th Biennial Colloquium & 6th International Workshop on Optical Wireless Communications

open access: yesIET Optoelectronics, 2023
Mónica Jorge Carvalho deFigueiredo   +3 more
doaj   +1 more source

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