Results 191 to 200 of about 13,359 (250)

Cross‐Sectoral AI Integration Is Essential to Tackling Food Waste and Food Insecurity: A Roadmap for Developing Resilient Food Systems

Advanced Intelligent Systems, EarlyView.
As food insecurity and global food demands surge, artificial intelligence (AI)‐based technologies offer promising opportunities to reduce food loss and waste. In this perspective, current AI adoption across the food supply chain is assessed using various academic, industry, and policy sources.
Akansha Prasad, Hannah Mann, Lubna Najm, Shadman Khan, Carlos D. M. Filipe, Tohid F. Didar   +5 more
wiley   +1 more source

Surpassing kilometer-scale terahertz wireless communication beyond 300 GHz enabled by hybrid photonic-electronic synergy. [PDF]

Light Sci Appl
Cai Y, Zhang L, Zhang J, Hua B, Ma K, Ding J, Bian X, Lei M, Liu Y, Li J, Xin Z, Chen X, Cai J, Pan P, Huang Y, Feng J, Zhu M, You X.   +17 more
europepmc   +1 more source

Towards Human‐Centered Intelligent Inhabitable Spaces: A Review

Advanced Intelligent Systems, EarlyView.
This review introduces Robot‐Rooms as a new category of architectural‐scale robots that do not operate within a space but actively form and reconfigure the space around their occupants. Drawing from robotics, HCI, architecture, and the arts, an interdisciplinary framework is proposed that maps the enabling technologies and integration challenges ...
Nithesh Kumar, Ge Lv, Keith E. Green, Ian D. Walker   +3 more
wiley   +1 more source

Overcoming the rate-power trade-off: multi-junction photovoltaic receivers for efficient near-infrared power and gigabit data transmission. [PDF]

NPJ Wirel Technol
Pellegrino C, Nacke R, Majlesein B, Younus O, Osahon INO, Babadi S, Schachtner M, Siefer G, Lackner D, Tavakkolnia I, Haas H, Helmers H.   +11 more
europepmc   +1 more source

A Comprehensive Review on Additive Manufacturing of Smart Components: Technologies, Applications, and Future Scope

Advanced Intelligent Systems, EarlyView.
How can additive manufacturing enable components that sense, adapt, heal, and power themselves? This review synthesizes recent advances in smart functionalities, manufacturing technologies, and intelligent design strategies, revealing a pathway toward fully integrated, autonomous, and multifunctional systems across diverse engineering sectors. Additive
Aiswarya Rony, P. M. Ushasree, Michael Short, Jinoop Arackal Narayanan   +3 more
wiley   +1 more source

Editorial to the Special Issue "Recent Advances in Optical Wireless Communications". [PDF]

Sensors (Basel)
Genoves Guzman B, Morales Céspedes M.
europepmc   +1 more source

Interbody Wire for Reconfigurable Robots: Bridging Integrated Morphological Reconfiguration and Distributed Wire‐Mediated Cooperation

Advanced Intelligent Systems, EarlyView.
TwinX shows how a single interbody wire connecting two robots can support both integrated morphological reconfiguration and distributed wire‐mediated cooperation. When the robots dock, they reconfigure into different forms for locomotion and manipulation.
Shintaro Inoue, Kento Kawaharazuka, Keita Yoneda, Sota Yuzaki, Temma Suzuki, Kei Okada   +5 more
wiley   +1 more source

Phase-independent wireless data aggregation via optical in-sensor computing. [PDF]

Nat Commun
Sun S, Lu Z, Wang Y, Liu Z, Mao Z, Shi Q, Wang F, Wang W, Jiang J, Lu B, He H, Pan X, Qian H, Ye Z.   +13 more
europepmc   +1 more source

Self‐Assembled Telecom Color Centers in Silicon and Their Growth Environment

Advanced Physics Research, EarlyView.
Influence of the growth pressure during the formation of self‐assembled color centers in silicon grown by molecular beam epitaxy at ultra‐low temperatures on the color center's photoluminescence spectral signature. The growth pressure crucially determines color center selectivity, as evidenced by G‐centers, W‐centers, and T‐centers, matrix purity, and ...
Jacqueline Marböck, Enrique Prado Navarrete, Merve Karaman, Oliver E. Lang, S. Mijatovic, Thomas Fromherz, Maciej O. Liedke, Andreas Wagner, Moritz Brehm, Johannes Aberl   +9 more
wiley   +1 more source

Microwave diffractive neural network chips for sensing and computing. [PDF]

Sci Adv
Chen L, Wu QW, Gu Z, Ma Q, Xiao L, Tian Z, Su WQ, Cui HY, You JW, Cui TJ.   +9 more
europepmc   +1 more source