Results 221 to 230 of about 13,982,318 (299)

Formation, Transformation, and Synergistic Interplay of Crystalline Orientation in Conjugated Polymers via Solution‐State Aggregation Control

Advanced Science, EarlyView.
Molecular engineering (i.e., tuning donors) and three film processing strategies (i.e., drop‐casting from different solvents, thermal and solvent vapor annealing, and blending) were synergistically utilized to tailor the solution‐state aggregation and thus the formation, transformation, and interplay of solid‐state crystalline orientation (face‐on and ...
Hao Zheng, Lixin Li, Yanan Guo, Bingjie Wu, Xuebing Luo, Hao Zhan, Yongjie Dong, Ze‐Fan Yao, Juan Peng, Jian Pei   +9 more
wiley   +1 more source

Development of metal-free layered semiconductors for 2D organic field-effect transistors.

Chem Soc Rev, 2021
Burmeister D, Trunk MG, Bojdys MJ.
europepmc   +1 more source

From Sensing Mechanisms to System Co‐Design: Graphene‐Based Sensors and Readout Circuits

Advanced Science, EarlyView.
This review establishes a unified PS–EQ–RF framework linking graphene sensing mechanisms, native electrical outputs, and output‐specific readout circuits. Voltage‐, current‐, resistance‐, and capacitance‐type sensing systems are systematically classified to guide architecture selection, low‐noise design, system co‐design, and practical integration ...
Jinduo Zhang, Meng Chen, Guanchen Li, Ruifeng Liu, Yingxin Wang, Ziran Zhao   +5 more
wiley   +1 more source

Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic

Advanced Science, EarlyView.
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim, Min Seok Kim, Joong Bum Rhim, Tae In Kim, Hyuck‐In Kwon, Ick‐Joon Park   +5 more
wiley   +1 more source

Integration of the evaporable spin-crossover complex [Fe(HB(1,2,4-triazol-1-yl)₃)₂] into organic field-effect transistors: towards multifunctional OFET devices. [PDF]

RSC Adv
Zhang Y, Séguy I, Soroceanu I, Rotaru A, Yu H, Salmon L, Molnár G, Bousseksou A.   +7 more
europepmc   +1 more source

Responsive Open Microfluidic Logic for Mechanical Computing

Advanced Science, EarlyView.
Coupling elasticity with capillarity transforms mechanical compression into binary fluidic states, enabling deterministic logic in open microfluidic circuits. This work demonstrates that computation can emerge from interactions between mechanic and fluidic domains, establishing a general strategy for embedding information processing directly within ...
Roi Almog, Bat‐El Pinchasik
wiley   +1 more source

Highly Oriented Liquid Crystal Semiconductor for Organic Field-Effect Transistors

ACS Central Science, 2018
Moon Jong Han, Dayan Wei, Yun Ho Kim, Hyungju Ahn, Tae Joo Shin, Noel A. Clark, David M. Walba, Dong Ki Yoon   +7 more
doaj   +1 more source

Solution‐Shearing of Highly Smooth Ion‐Gel Thin Films: Facilitating the Deposition of Organic Semiconductors for Ion‐Gated Organic Field Effect Transistors

Advanced Electronic Materials, Volume 11, Issue 6, May 2025.
A straightforward method is introduced to produce ion‐gel films with very low surface roughness by employing a solution‐shearing coating process. These ion‐gel films permit the growth of crystalline thin films of various small molecule organic semiconductor molecules directly on top of the ion‐gel layer, thereby enabling “inverted” small molecule ...
Jonathan Perez Andrade, Angelika Wrzesińska‐Lashkova, Anupam Prasoon, Felix Talnack, Katherina Haase, Bernd Büchner, Xinliang Feng, Yana Vaynzof, Mike Hambsch, Yulia Krupskaya, Stefan C. B. Mannsfeld   +10 more
wiley   +1 more source

Twisted MoS2 Bilayers as Functional Elements in Memtransistors: Hysteresis, Optical Signatures, and Photocurrent Kinetics

Advanced Electronic Materials, EarlyView.
ABSTRACT Layered 2D materials are considered as promising for memristive applications due to their ultimate vertical scalability compared to conventional semiconductor films and pronounced hysteresis properties. Bias‐resolved Raman and Photoluminescence mapping is used to quantify strain from phonon shifts and carrier density from the exciton‐trion ...
Vladislav Kurtash, Ilya Eliseyev, Valery Davydov, Heiko O. Jacobs, Jörg Pezoldt   +4 more
wiley   +1 more source

Emerging Memory and Device Technologies for Hardware‐Accelerated Model Training and Inference

Advanced Electronic Materials, EarlyView.
This review investigates the suitability of various emerging memory technologies as compute‐in‐memory hardware for artificial intelligence (AI) applications. Distinct requirements for training‐ and inference‐centric computing are discussed, spanning device physics, materials, and system integration.
Yoonho Cho, Dae‐won Kim, Yujin Kim, Jung‐Heum Na, Yuwon Jeong, Dong‐Yeop Lee, Shinhyun Choi   +6 more
wiley   +1 more source