Results 241 to 250 of about 252,870 (332)
Photocatalytic Water Splitting on the Lunar Surface: Prospects for In Situ Resource Utilization
Water has been found in craters on the moon nearby locations which are illuminated >80% of the time. Photocatalysis uses energy from sunlight to drive chemical reactions such as water splitting to produce oxygen and hydrogen. It is a scalable technology that requires lighter equipment and utilizes resources available on the moon. ABSTRACT The discovery
Ranjani Kalyan +6 more
wiley +1 more source
Solar Cells: From Sunlight into Electricity
Serap Günes +3 more
doaj +1 more source
Recent Progress in Dimerized Small-Molecular Acceptors for Organic Solar Cells. [PDF]
Tang X, Zhang Y, Zhang HL.
europepmc +1 more source
Electron, Energy, and Hole Transfer Dynamics in D1:D2:ATernary Organic Solar Cells
Tanjin Lv (22350826) +5 more
openalex +1 more source
Spin‐coated films of the conjugated polymer F8T2 (poly (9,9‐dioctylfluorene‐alt‐bithiophene)) generate superoxide at the film‐medium interface, enabling precise delivery of reactive oxygen species (ROS) as visible‐light “ROS patches.” Coated surfaces drive rapid, localised cytotoxicity in MCF7 cancer monolayers under white light, providing a reagent ...
Joe Kaye +8 more
wiley +1 more source
The art and science of translucent color organic solar cells. [PDF]
Deng B +9 more
europepmc +1 more source
This study highlights the importance of designing photoanode architectures for solar water splitting that align intrinsic material properties with functional interfaces to optimize the extraction of photogenerated charges. The incorporation of NiOx surface layers in LaTiO2.5N0.5 (LTON) thin film photoanodes exemplifies this approach by leveraging band ...
Eric Burns +4 more
wiley +1 more source
Sulfur-Doped ZnO as Cathode Interlayer for Efficient Inverted Organic Solar Cells. [PDF]
Polydorou E +11 more
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source

