Results 231 to 240 of about 2,100,534 (347)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

All‐Printed, Flexible, Organic Thermoelectric Generators for Ambient Operation with Enhanced Performance under Mechanical Bending

open access: yesAdvanced Materials Technologies, EarlyView.
Fully printed bipolar organic thermoelectric generators are fabricated on flexible substrates and characterized entirely under ambient conditions. The devices exhibit Seebeck coefficients up to 30 µV K−1 and output powers up to 8.8 nW, with enhanced performance under bending.
Loup Chopplet   +7 more
wiley   +1 more source

Individual variability in the nuclei of the human superior olivary complex. [PDF]

open access: yesBrain Struct Funct
Farid Y   +3 more
europepmc   +1 more source

Response to Comment on “Universality in the Evolution of Orientation Columns in the Visual Cortex“

open access: green, 2012
Wolfgang W. Keil   +7 more
openalex   +2 more sources

Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley   +1 more source

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