Results 171 to 180 of about 137,594 (271)

Thermally Pre‐Formed Reconfigurable Resistive Random‐Access Memory Crossbar Arrays: A Dual‐Mode Platform for Robust Physically Unclonable Functions and In‐Memory Computing

open access: yesAdvanced Functional Materials, EarlyView.
A reconfigurable RRAM platform utilizing thermally pre‐formed filaments (TPFs) is developed to realize robust hardware security. By exploiting the thermodynamic stochasticity of TPFs, exceptionally reliable physically unclonable functions (PUFs) are achieved.
Seongbin Kwon   +4 more
wiley   +1 more source

Development of a Three‐Axis Planar Hall Magnetoresistance Sensor Using a Superparamagnetic Nanoparticle‐Based Flux Guide

open access: yesAdvanced Functional Materials, EarlyView.
A printed superparamagnetic nanoparticle‐based flux guide enables the realization of a hysteresis‐free three‐axis magnetic sensor. This innovative architecture efficiently redirects out‐of‐plane fields to planar sensing elements, facilitating simultaneous vector detection without complex reset protocols.
Changyeop Jeon   +10 more
wiley   +1 more source

Interlayer Expansion of Bulk MoS2 via Top‐Down Organic Pillaring Enables Tunable Li+ Intercalation and Controlled Solvent Co‐Intercalation

open access: yesAdvanced Functional Materials, EarlyView.
Top‐down organic pillaring expands the interlayer spacing of bulk‐sized MoS2 particles while preserving the bulk morphology. Operando X‐ray diffraction and electrochemical dilatometry show that MoS2‐bulk undergoes solvent co‐intercalation in diglyme electrolyte, causing large structural expansion, while pillared, expanded MoS2 suppresses solvent uptake
Jaehoon Choi   +8 more
wiley   +1 more source

Interface Effects in Ultrathin Silicon on Insulator Films

open access: yesAdvanced Functional Materials, EarlyView.
This work establishes a systematic framework to discriminate how bulk and interface phenomena affect charge transport in ultrathin P‐doped silicon‐on‐insulator (SOI) films. For Si films below 15 nm, electrical characterization demonstrates that interface states drive charge transport, shifting the metal‐insulator transition (MIT) critical dopant ...
Andrea Pulici   +8 more
wiley   +1 more source

Double‐Interpenetrating Composite Bioink for Multi‐Component 3D Bioprinting and Biofabrication

open access: yesAdvanced Functional Materials, EarlyView.
Marine‐polysaccharides‐derived double interpenetrating network hydrogel‐based bioink, combining the attributes of physical and ionic crosslinking, enables room‐temperature bioprinting of mechanically defined structures that can be handled and are cytocompatible.
Fabian Tribukait‐Riemenschneider   +1 more
wiley   +1 more source

Home - About - Disclaimer - Privacy