Results 211 to 220 of about 237,241 (298)

Programmable Crack Networks for Wide‐Range and Reversible Strain Sensing in Vertically Oriented van der Waals Molybdenum Disulfide Thin Films

open access: yesAdvanced Materials Technologies, EarlyView.
Vertically oriented van der Waals MoS2 thin films enable a mechanically programmable crack network for strain sensing. The initial mechanical programming protocol establishes a programmed crack configuration along weak interlayer and interdomain interfaces.
Yinli Wang, Hiroyuki Hirakata
wiley   +1 more source

Recent Advances in Transparent Microelectrode Device Architecture and Fabrication Strategies for Biomedical Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transparent microelectrode arrays enable simultaneous optical and electrical electrophysiology with high spatiotemporal resolution, allowing multimodal observations of dynamic biological systems. Advances in materials and device architectures improve device performance by addressing key trade‐offs between optical transparency, impedance, and ...
Michael Abraham Listyawan   +6 more
wiley   +1 more source

Liquid Metal Resistive Sensing Architectures for Measuring Diaphragm Strain Responses on Obstructed Surfaces

open access: yesAdvanced Materials Technologies, EarlyView.
A liquid metal‐based strain‐sensing architecture to measure the deformation of a circular diaphragm against obstructed surfaces is formulated using finite element modeling and confocal imaging to establish the mechanical framework and is utilized to control diaphragm‐induced confinement on a bead array, as validated by biomolecular loading level ...
Abdullah‐Bin Siddique   +4 more
wiley   +1 more source

Wafer‐Scale Top‐Down Patterning of Metal Halide Perovskites

open access: yesAdvanced Materials Technologies, EarlyView.
Wafer‐scale patterning of metal halide perovskite films is demonstrated on 150 mm substrates using a chemically amplified resist, polymethyl methacrylate (CAR‐PMMA) and a single reactive ion etching step. The streamlined process preserves film luminescence while defining submicrometer features across the full wafer, enabling dense, scalable integration
Federico Fabrizi   +7 more
wiley   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

Recent Advances in Light‐Addressable Electrochemistry for Spatially Resolved Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This comprehensive review highlights light‐addressable electrochemistry as a powerful tool that uses light to control localized chemical reactions on unstructured semiconductor surfaces. The work evaluates advanced strategies to optimize electrode materials for enhanced spatial resolution and stability. Furthermore, it showcases diverse applications in
Nhi Trang Vo   +2 more
wiley   +1 more source

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