Results 271 to 280 of about 3,242,426 (284)

Finite Element Analysis of 2.5D Packaging Processes Based on Multi-Physics Field Coupling for Predicting the Reliability of IC Components

Microelectronics Reliability
Mengxuan Cheng, Zhiyan Zhao, Ruiqian Zheng   +2 more
exaly  

Leaching of Elements From Packaging Material Into Canned Foods Marketed in India

Food Control, 2014
exaly  

Package of environmental sensitive element

2017
CHEN KUANG-JUNG, PENG YI-HAO, SU HSIN-YUAN   +2 more
openaire   +1 more source

5527570 Multilayer multifunctional packaging elements

Journal of Cleaner Production, 1996
openaire   +1 more source

GENOMIC RNA PACKAGING ENHANCER ELEMENT

2015
openaire   +4 more sources

A Coupled Finite Element–Boundary Element Method for Transient Elastic Dynamic Analysis of Electronic Packaging Structures

Engineering Structures
Fei Qin, Xiaoying Zhuang, Yanpeng Gong
exaly  

Shielding elements for packages of semiconductor devices

2023
RAJOO RANJAN, VANUKURU VENKATA NARAYANA RAO   +1 more
openaire   +1 more source

Packaging and distributing service elements

2011
openaire   +1 more source

INFRARED DETECTOR PACKAGED WITH IMPROVED ANTIREFLECTION ELEMENT

2002
openaire   +4 more sources

Package of environmental sensitive electronic element

2015
CHEN KUANG-JUNG, WU JIAN-LIN, YEH SHU-TANG   +2 more
openaire   +1 more source