Results 131 to 140 of about 305,584 (295)

Deterministic hBN Bubbles as a Versatile Platform for Studies on Single‐Photon Emitters

open access: yesAdvanced Functional Materials, EarlyView.
Single‐photon emitters (SPEs) in hBN are promising for quantum technologies; however, in exfoliated samples their activation is required, limiting reproducibility of previous studies. This work introduces a large‐area MOVPE‐grown hBN platform that hosts SPEs without prior activation.
Piotr Tatarczak   +8 more
wiley   +1 more source

From Mechanics to Electronics: Influence of ALD Interlayers on the Multiaxial Electro‐Mechanical Behavior of Metal–Oxide Bilayers

open access: yesAdvanced Functional Materials, EarlyView.
Ultrathin AlOxHy interlayers between aluminum films and polymer substrates significantly improve electro‐mechanical properties of flexible thin film systems. By precisely controlling interlayer thickness using atomic layer deposition, this study identifies an optimal interlayer thickness of 5–10 nm that enhances ductility and delays cracking.
Johanna Byloff   +9 more
wiley   +1 more source

Quasi‐Static to Supersonic Energy Absorption of Nanoarchitected Tubulanes and Schwarzites

open access: yesAdvanced Functional Materials, EarlyView.
Nanoarchitected energy‐absorptive Tubulanes exhibit record energy absorption under quasi‐static conditions and exceptional inelastic energy dissipation under 750 m s−1 ballistics impact, with high performance spanning strain rates of 12 orders of magnitude.
Peter Serles   +16 more
wiley   +1 more source

Magnetism and Nonlinear Charge Transport in NiFe2O4/γ‐Al2O3/SrTiO3 Heterostructure: Toward Spintronic Applications

open access: yesAdvanced Functional Materials, EarlyView.
In this report, we demonstrate that a crystalline phase of 52nm thick NiFe2O4 can be grown by RF sputtering on top of γ‐Al2O3(8nm)/SrTiO3 at a significantly low temperature (150 °C) without compromising the mobility and carrier density of the 2D electron gas at the γ‐Al2O3(8nm)/SrTiO3 interface.
Amit Chanda   +11 more
wiley   +1 more source

Effect of crack position and loading conditions on SIF in SiC particles reinforced Al composite

open access: yesFracture and Structural Integrity, 2019
In this paper the effect of reinforcement crack position and loading conditions (in mode I) on the stress intensity factors of the Al/SiCp metal matrix composite was examined using a finite element method.
Aicha Metehri   +2 more
doaj  

Numerical simulation of bidirectional compression molding of binary composite powder particles

open access: yesAIP Advances
Powder metallurgy is a cornerstone of advanced manufacturing and faces research challenges in achieving fully densified and homogeneous microstructures, especially for composites with different compositions.
Wenchao Wang   +5 more
doaj   +1 more source

Geometric effects of sustainable auxetic structures integrating the particle swarm optimization and finite element method [PDF]

open access: yesMaterials Research, 2014
The development of new materials based on industrial wastes has been the focus of much research for a sustainable world. The growing demand for tyres has been every year exacerbating environmental problems due to indiscriminate disposal in the nature ...
Sergio Luiz Moni Ribeiro Filho   +5 more
doaj  

Bio‐Inspired Molecular Events in Poly(Ionic Liquids)

open access: yesAdvanced Functional Materials, EarlyView.
Originating from dipolar and polar inter‐ and intra‐chain interactions of the building blocks, the topologies and morphologies of poly(ionic liquids) (PIL) govern their nano‐ and micro‐processibility. Modulating the interactions of cation‐anion pairs with aliphatic dipolar components enables the tunability of properties, facilitated by “bottom‐up ...
Jiahui Liu, Marek W. Urban
wiley   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

open access: yesAdvanced Functional Materials, EarlyView.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

Application and development of numerical simulation on mesoscopic analysis of powder compaction

open access: yesFenmo yejin jishu
In recent years, numerical simulation technology has become an important method to study the powder compaction process. The discrete element method (DEM) is used to study the mechanical behavior of powder particles from the mesoscopic perspective ...
CHEN Xinyu, LI Fenqiang, JIANG Jishuai
doaj   +1 more source

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