Results 101 to 110 of about 244,017 (337)

Navigating Ternary Doping in Li‐ion Cathodes With Closed‐Loop Multi‐Objective Bayesian Optimization

open access: yesAdvanced Materials, EarlyView.
The search for advanced battery materials is pushing us into highly complex composition spaces. Here, a space with about 14 million unique combinations is efficiently explored using high‐throughput experimentation guided by Bayesian optimization with a deep kernel trained on both the Materials Project database and our data.
Nooshin Zeinali Galabi   +6 more
wiley   +1 more source

Self‐Assembled Fluorescent Nanodiamond Layers for Quantum Imaging

open access: yesAdvanced Materials Interfaces, EarlyView.
We developed a simple, scalable method for coating surfaces with fluorescent nanodiamonds. By optimizing the coating process, we created uniform, dense layers that enable high‐resolution magnetic imaging using the nitrogen‐vacancy (NV) center in nanodiamonds. This approach enables the development of cost‐effective quantum‐sensing and imaging substrates
Katherine Chea   +8 more
wiley   +1 more source

Octanol/Water Partitioning Coefficients of PCB Mixtures for Environmental Fate and Transport [PDF]

open access: yes, 2013
Polychlorinated biphenyls (PCBs) are a human and environmental toxin introduced to the environment from the 1920’s to the 1970’s from manufacturing items such as transformers and capacitors.
Cicilio, Phylicia
core   +1 more source

Topology invariance in Percolation Thresholds

open access: yes, 1998
An universal invariant for site and bond percolation thresholds (p_{cs} and p_{cb} respectively) is proposed. The invariant writes {p_{cs}}^{1/a_s}{p_{cb}}^{-1/a_b}=\delta/d where a_s, a_b and \delta are positive constants,and d the space dimension.
Galam, Serge, Mauger, Alain
core   +3 more sources

Advanced Techniques for Scalable Woven E‐Textiles Manufacturing

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Lessons Learned in Applying Accelerometers to Nuclear Effects Testing

open access: yesShock and Vibration, 2008
Exoatmospheric nuclear effects, such as those that would be encounter by reentry bodies, provide instantaneous (near zero-duration), impulsive loading of structures. Endoatmospheric nuclear effects possess an impulse that is finite in duration, but whose
Patrick L. Walter
doaj   +1 more source

Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits

open access: yesAdvanced Materials Technologies, EarlyView.
A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova   +3 more
wiley   +1 more source

An ohmic RF MEMS switch for reconfigurable microstrip array antennas built on PCB [PDF]

open access: yes, 2008
This paper presents the analysis, design and simulation of an ohmic RF MEMS switch specified for reconfigurable microstrip array antennas built on PCB via an integrated monolithic technology.
Charalampidis, N   +6 more
core  

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