Results 181 to 190 of about 1,387,416 (334)

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

W‐Based Thin Film Metallic Glasses Doped with Ni, Zr, and B for Industrial Applications

open access: yesAdvanced Engineering Materials, EarlyView.
This work is the first to deal with a comprehensive comparison of two metallic glass systems, W–Zr–B and W–Ni–B, in terms of their suitability for specific industrial applications. Their mechanical and tribological properties are compared and discussed in combination with structural homogeneity on different types of technically relevant substrates and ...
Zbynek Studeny   +5 more
wiley   +1 more source

ON SECOND-ORDER ALMOST-PERIODIC ELLIPTIC OPERATORS [PDF]

open access: green, 2001
Nick Dungey   +2 more
openalex   +1 more source

Optimized Strategy for Fabricating High‐Aspect‐Ratio Periodic Structures Over Large Areas Using ps‐Direct Laser Interference Patterning

open access: yesAdvanced Engineering Materials, EarlyView.
Picosecond direct laser interference patterning (DLIP) enables precise microstructure fabrication on stainless steel. Using a multiscan approach, high‐aspect‐ratio patterns are achieved. Fluence influences structure growth and homogeneity, with smaller periods yielding better uniformity.
Fabian Ränke   +5 more
wiley   +1 more source

Sol–Gel Synthesis of Ca2.5Ag0.3Sm0.2Co4O9 Semiconducting Materials for Thermoelectric Applications in Aerospace Systems

open access: yesAdvanced Engineering Materials, EarlyView.
Ca2.5Ag0.3Sm0.2Co4O9 semiconductor materials are synthesized and produced in this study using the sol–gel and cold pressing techniques for thermoelectric generator applications. As template samples are added, the Seebeck coefficient and power factor values rise, peaking at 800 °C for Ca2.5Ag0.3Sm0.2Co4O9 at 274.47 μV K−1 and 0.58 mW mK−2, respectively.
Enes Kilinc   +4 more
wiley   +1 more source

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