Results 141 to 150 of about 70,835 (229)

People Counting and Positioning Using Low‐Resolution Infrared Images for FeFET‐Based In‐Memory Computing

open access: yesAdvanced Electronic Materials, EarlyView.
In this work, low‐resolution infrared imaging is combined with a 28 nm FeFET IMC architecture to enable compact, energy‐efficient edge inference. MLC FeFET devices are experimentally characterized, and controlled multi‐level current accumulation is validated at crossbar array level.
Alptekin Vardar   +9 more
wiley   +1 more source

Topological Materials and Related Applications

open access: yesAdvanced Electronic Materials, EarlyView.
This review covers topological materials—including topological insulators, quantum valley Hall and quantum spin Hall insulators, and topological Weyl and Dirac semimetals—as well as their most recent advancements in fields such as spintronics, electronics, photonics, thermoelectrics, and catalysis.
Carlo Grazianetti   +9 more
wiley   +1 more source

Bio‐Inspired Mechanical Amplification Block on Implantable Tactile Sensors

open access: yesAdvanced Electronic Materials, EarlyView.
 . ABSTRACT Implantable strain sensors offer opportunities for continuous biomechanical monitoring, but their performance deteriorates severely once embedded in soft tissue due to mechanical shielding that suppresses strain transmission to the sensing layer.
Sungbin Choi   +5 more
wiley   +1 more source

Ion‐Gating Reservoir Computing for Preprocessing‐Free Speech Recognition from Throat Vibrations

open access: yesAdvanced Electronic Materials, EarlyView.
This work presents a throat‐mounted mechanoelectric sensor integrated with an ion‐gel/graphene reservoir device for on‐device speech recognition. The system converts raw biomechanical vibrations into rich nonlinear current dynamics, enabling efficient classification through a simple linear readout. The approach highlights a compact and tunable physical‐
Daiki Nishioka   +5 more
wiley   +1 more source

CsPbBr3–Nanodiamonds Hybrid Wafers for Mechanically Robust, High‐Performance X‐Ray Detection

open access: yesAdvanced Electronic Materials, EarlyView.
NDs‐engineered CsPbBr3 hybrid wafers, fabricated via scalable solid‐state grinding and cold pressing, utilize trace NDs to regulate mechanochemical conversion, promote heterogeneous nucleation, bridge grain boundaries, and passivate interfacial defects. The optimized wafer exhibits dense microstructures, improved charge transport, reduced dark current,
Yanan Gong   +11 more
wiley   +1 more source

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