Results 171 to 180 of about 9,286,395 (294)

A U‐shaped Microfluidic Platform for Culturing Vascularized Colorectal Cancer Spheroids Reveals Tumor–Endothelial Crosstalk and Invasion‐Associated Remodeling

open access: yesAdvanced Materials Technologies, EarlyView.
A closed U‐shaped microfluidic platform symmetrically embeds a single, size‐controlled HT29 colorectal cancer spheroid within a GFP‐HUVEC‐laden fibrin matrix. HT29 spheroids are associated with hyper‐branched endothelial network remodeling, while vascularized co‐culture is accompanied by anisotropic protrusive growth and EMT‐like marker changes in the ...
G. Cretti   +4 more
wiley   +1 more source

Programmable Variable‐Stiffness Multilayer Elastomer Composites With High‐Aspect‐Ratio Low‐Melting‐Point Alloy Inclusions

open access: yesAdvanced Materials Technologies, EarlyView.
High‐aspect‐ratio low‐melting‐point alloy inclusions are embedded within multilayer silicone laminates to create thermally programmable stiffness. Sequential activation of alloy‐rich layers produces four distinct mechanical states and reconfigures tendon‐driven actuator trajectories under the same load.
Palpolage Don Shehan Hiroshan Gunawardane   +4 more
wiley   +1 more source

Toward Perception‐Native Electronic Skin: Bio‐Inspired In‐/Near‐Sensor and Neuromorphic Computing for Humanoid Robots

open access: yesAdvanced Materials Technologies, EarlyView.
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim   +6 more
wiley   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Copper Electroplated TPMS Polymer Lattices for Lightweight Absorption Dominant Electromagnetic Interference Shielding

open access: yesAdvanced Materials Technologies, EarlyView.
Copper electroplating transforms lightweight 3D‐printed TPMS polymer lattices into effective electromagnetic shields. Topology, relative density, and conductive seed layer continuity govern copper penetration, electrical resistance, and attenuation. SEA consistently exceeds SER, while 35% RD Diamond lattice gives the best performance, reaching 48.72 dB
Aman Al Khatib   +6 more
wiley   +1 more source

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