Results 121 to 130 of about 5,213 (259)

A 1.11 mm<sup>2</sup> IVUS SoC With -Range Plane Wave Transmit Beamforming at 40 MHz. [PDF]

open access: yesIEEE Trans Biomed Circuits Syst
Zhang X   +6 more
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Acoustic and Ultrasonic Sensing Technology in Non-Destructive Testing. [PDF]

open access: yesSensors (Basel)
Castiñeira-Ibáñez S   +2 more
europepmc   +1 more source

Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley   +1 more source

Roadmap to Precision 3D Printing of Cellulose: Rheology‐Guided Formulation, Fidelity Assessment, and Application Horizons

open access: yesAdvanced Materials Technologies, EarlyView.
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini   +3 more
wiley   +1 more source

Validation of Novel Ultrasonic Phased Array Borehole Probe by Using Simulation and Measurement. [PDF]

open access: yesSensors (Basel), 2022
Prabhakara P   +5 more
europepmc   +1 more source

Home - About - Disclaimer - Privacy