Results 281 to 290 of about 754,043 (343)

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

open access: yesAdvanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek   +4 more
wiley   +1 more source

Electrochemical‐Doping of Tungsten on Nickel‐Boron‐Phosphide Microspheres for Accelerated Industrial‐Scale Water Electrolysis at High Current Density

open access: yesAdvanced Materials Technologies, EarlyView.
The bifunctional W/NiBP (+) || W/NiBP (−) demonstrates superior overall water splitting (OWS) performance as compared to the benchmark of Pt/C (+) || RuO2 (−). Notably, the W/NiBP (+, −) exhibits an ultra‐low cell voltage of 2.68 V at 2000 mA cm−2 high current density as compared to the benchmark value of 3.29 V.
Md Ahasan Habib   +6 more
wiley   +1 more source

High‐Performance Black Phosphorus/Graphitic Carbon Nitride Heterostructure‐Based Wearable Sensor for Real‐time Sweat Glucose Monitoring

open access: yesAdvanced Materials Technologies, EarlyView.
This work introduces a BP‐gCN heterostructure‐based wearable glucose sensor designed for continuous, non‐invasive glucose monitoring. By enhancing electrochemical glucose oxidation, the sensor exhibits improved sensitivity and stability. The integration of DFT calculations and experimental results demonstrates the superior electrocatalytic performance ...
Ecem Ezgi Özkahraman   +9 more
wiley   +1 more source

Efficacy of tenapanor in managing hyperphosphatemia and constipation in hemodialysis patients: A randomized controlled trial. [PDF]

open access: yesPLoS One
Suzuki N   +12 more
europepmc   +1 more source

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