Results 211 to 220 of about 269,642 (338)
Micro-transfer printing of O-band InAs/GaAs quantum-dot SOAs on silicon photonic integrated circuits [PDF]
Yang Liu +13 more
openalex +1 more source
This study reveals the potential to manipulate spin‐valley polarization dynamics in MoSe2/WSe2 heterostructures by quantifying different scattering processes following selective photoexcitation. The results show that these heterostructures enable ultrafast valley‐selective charge transfer, with phonon scattering playing a significant role in the ...
Julian Wagner +9 more
wiley +1 more source
Bound-state-in-continuum guided modes in a multilayer electro-optically active photonic integrated circuit platform. [PDF]
Han K, Lebrun TW, Aksyuk VA.
europepmc +1 more source
I/O-efficient iterative matrix inversion with photonic integrated circuits [PDF]
Minjia Chen +6 more
openalex +1 more source
Edge Couplers in Silicon Photonic Integrated Circuits: A Review
Xin Mu +3 more
openalex +1 more source
Ka-band to L-band frequency down-conversion based on III–V-on-silicon photonic integrated circuits [PDF]
Kasper Van Gasse +6 more
openalex +1 more source
Chalcogenide optical PCMs have gathered interest for their potential in compact, non‐volatile optics and photonics. Free‐space PCM metasurfaces require new considerations from phase change memory that need to be addressed for reliable scale‐up. Several failure mechanisms pertaining to free‐space PCM devices and layout methods are isolated to prevent ...
Cosmin Constantin Popescu +19 more
wiley +1 more source
Advanced Microwave Photonics Techniques for Programmable Photonic Integrated Circuits
Cristina Catalá-Lahoz
openalex +2 more sources
Photonic-integrated circuit for continuous-wave THz generation
Michael Theurer +6 more
openalex +2 more sources
Photonic Hybrid Integration: Strategies and Promises of Advanced Additive Manufacturing
Heterogeneous photonic integration combines wafer bonding, transfer printing, and advanced multi‐photon lithography to realize compact, adaptable photonic systems. This review highlights breakthroughs in hybrid materials, metrology, and 4D printing, revealing how the convergence of traditional and emerging fabrication unlocks scalable, high‐performance
Zhitian Shi +3 more
wiley +1 more source

