Results 231 to 240 of about 680,645 (276)

Microenvironment Modulation‐Based Nanomaterial‐Loaded Hydrogel Dressings for Diabetic Foot Ulcers: Research Progress and Future Perspectives

open access: yesAdvanced Materials Interfaces, EarlyView.
xx xx. ABSTRACT Diabetic foot ulcer (DFU) is a chronic complication of diabetes, primarily caused by hyperglycemia, peripheral vascular disease, and neuropathy. Characterized by persistent hyperglycemia, impaired perfusion, inflammation, and infection, DFUs pose significant challenges to healing and are associated with high morbidity and amputation ...
Tang Yuqing   +5 more
wiley   +1 more source

Defect Properties and Band Energetics of Atomic Layer Deposited MoOX on Crystalline Si

open access: yesAdvanced Materials Interfaces, EarlyView.
Atomic layer deposited MoOx thin films grown using oxygen plasma and ozone co‐reactants exhibit tunable defect densities and band energetics. Optical and X#x02010;ray photoelectron spectroscopies reveal oxygen#x02010;vacancy#x02010;induced defect and polaron states and their impact on band alignment at the c#x02010;Si/MoOx interface, providing insight ...
Namitha Dsouza   +3 more
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

open access: yesAdvanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz   +5 more
wiley   +1 more source

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

open access: yesAdvanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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