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1998
Similar to CVD, PVD (physical vapor deposition) has an important position among film formation techniques. The most typical PVD technique is sputtering, which is used to produce aluminum alloys or barrier films with metals having a high melting point, and is used mainly for metal film formation.
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Similar to CVD, PVD (physical vapor deposition) has an important position among film formation techniques. The most typical PVD technique is sputtering, which is used to produce aluminum alloys or barrier films with metals having a high melting point, and is used mainly for metal film formation.
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1989
In the early days of microelectronics, physical vapor deposition was simply applied to the evaporation of Al to form the high conductivity connections to transistors. With the ever-increasing complexity of silicon integrated circuits and the development of GaAs circuits, a much wider range of materials must be deposited to fulfill special needs for ...
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In the early days of microelectronics, physical vapor deposition was simply applied to the evaporation of Al to form the high conductivity connections to transistors. With the ever-increasing complexity of silicon integrated circuits and the development of GaAs circuits, a much wider range of materials must be deposited to fulfill special needs for ...
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ZnO Nanocrystals Synthesized by Physical Vapor Deposition
Journal of Nanoscience and Nanotechnology, 2004Various types of zinc oxide (ZnO) nanocrystais were synthesized by physical vaporization of zinc powders without the presence of catalysts and a subsequent exposure to air at a high temperature. These crystals were found to be composed of ZnO nanowires, sheets, and tetrapods. They were observed to crystallize as wurtzite ZnO single crystals.
Hansoo, Kim, Wolfgang, Sigmund
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Strontium hafnate films deposited by physical vapor deposition
Thin Solid Films, 2006Abstract Strontium hafnate films are predicted to have desirable properties for use as a high-permittivity gate insulator. Such a film is of extreme interest to the scaling of Metal Oxide Semiconductor (MOS) transistors. Thin films of strontium hafnate have been prepared by cosputtering of Hf and SrO2.
I. McCarthy +5 more
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Physical vapor deposition tool coatings
Surface and Coatings Technology, 1996Abstract Physical vapor deposition (PVD) of hard coatings such as titanium nitride have been an industrial reality since the beginning of the 1980s. Two PVD processes, low voltage electron beam and cathodic arc deposition, were responsible for the early commercial success of hard coatings on high speed steel tooling.
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Physical vapor deposition (PVD) processes
Metal Finishing, 1995Summary Each of the PVD processes discussed has its advantages and disadvantages. Each requires different process monitoring and controlling techniques. Generally, the most simple technique and configuration that will give the desired film properties and most economical product throughput should be used.
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Physical Vapor Deposition; Sputtering
1990It is necessary in wafer processing to add conductive materials to serve as interconnects, and dielectrics as insulators on the wafer. Two commonly used methods for doing this are: physical vapor deposition (PVD), which involves vacuum evaporation and deposition, and sputtering, which takes place in a gas at low pressure.
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COATING, TITANIUM NITRIDE Physical Vapor Deposition
2021<div class="section abstract"> <div class="htmlview paragraph">This specification covers the requirements for the application and properties of a titanium nitride coating on metal parts applied by physical vapor deposition (PVD).</div></div>
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