Results 201 to 210 of about 9,169,325 (384)
Hybrid piezoelectric scaffolds offer a promising route for Central Nervous System regeneration by combining structural and electrical cues to support neural stem cell growth. This review highlights their potential to overcome current challenges in neural tissue engineering by exploring porous hybrid materials, their biological interactions, and ...
Heather F. Titterton +2 more
wiley +1 more source
Screening of the bound polarization charges of ferroelectrics at electrode interfaces is accommodated either by electrode charges or by charge injection. By means of X‐ray photoelectron spectroscopy with in‐situ polarization reversal, it is demonstrated that screening charges at antiferroelectric La‐doped Pb(Zr,Ti)O3 are injected, while they remain at ...
Binxiang Huang +6 more
wiley +1 more source
Identification of material properties of sandwich structure with piezoelectric patches [PDF]
Robert Zemčík, Petr Sadílek
openalex
Piezoelectric Behaviour of Several Ceramic Materials at Low Temperatures [PDF]
S. Vieǐra, M. A. Ramos, R. Villar
openalex +1 more source
Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini +4 more
wiley +1 more source
A Comparative Study of Material and Structural Configurations in Piezoelectric Energy Harvesting [PDF]
Fahmidul Huq Syed +4 more
openalex +1 more source
Scaled boundary finite element analysis of stress singularities in piezoelectric multi‐material systems [PDF]
Wibke Mayland, Wilfried Becker
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Dependence of local atomic structure on piezoelectric properties of PbZr1−xTixO3 materials
Il-Gok Hong +5 more
openalex +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source

