Screening of the bound polarization charges of ferroelectrics at electrode interfaces is accommodated either by electrode charges or by charge injection. By means of X‐ray photoelectron spectroscopy with in‐situ polarization reversal, it is demonstrated that screening charges at antiferroelectric La‐doped Pb(Zr,Ti)O3 are injected, while they remain at ...
Binxiang Huang +6 more
wiley +1 more source
Piezoelectric properties improvement in soft membrane with wet-spinning prepared barium titanate/polyvinylidenefluoride composites fiber. [PDF]
Lin XW +5 more
europepmc +1 more source
Development and Piezoelectric Properties of a Stack Units-Based Piezoelectric Device for Roadway Application. [PDF]
Li C +6 more
europepmc +1 more source
Preparation, Characterization, Dielectric, Piezoelectric and Ferroelectric Properties of Yttrium and Praseodymium Doped Lead Titanate Ceramics [PDF]
Karan Singh +3 more
openalex +1 more source
Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini +4 more
wiley +1 more source
Enhanced Piezoelectric Properties and Conduction Mechanism in Na<sub>0.5</sub>Bi<sub>2.5</sub>Nb<sub>2</sub>O<sub>9</sub> Piezoelectric Ceramics. [PDF]
Deng J +9 more
europepmc +1 more source
Effect of Contents on the Electrical and Piezoelectric Properties of (1 - x)(Bi, Na)TiO3-x(Ba, Sr)TiO3 Lead-Free Piezoelectric Ceramics. [PDF]
Kang SM, Kim TW, Kim NH, Kim SJ, Koh JH.
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source

