Results 61 to 70 of about 17,071 (327)

3D-Printed Load Cell Using Nanocarbon Composite Strain Sensor

Sensors, 2021
The development of a 3D-Printed Load Cell (PLC) was studied using a nanocarbon composite strain sensor (NCSS) and a 3D printing process. The miniature load cell was fabricated using a low-cost LCD-based 3D printer with UV resin.
Kwan-Young Joung, Sung-Yong Kim, Inpil Kang, Sung-Ho Cho   +3 more
doaj   +1 more source

Mechanical, electrical and electro-mechanical properties of thermoplastic elastomer styrene–butadiene–styrene/multiwall carbon nanotubes composites [PDF]

, 2013
Composites of styrene-butadiene-styrene (SBS) block copolymer with multiwall carbon nanotubes (MWCNT) were processed by solution casting in order to investigate the influence of filler content, the different ratio of styrene/butadiene in the ...
A Celzard, A Falco De, A Miller, AI Oliva-Avilés, AJ Paleo, AV Kyrylyuk, C Grimaldi, C Li, D Stauffer, ET Thostenson, H Koerner, H Lorenz, I Balberg, I Kang, J Silva, J Silva, J-H Du, J. C. Viana, J. Silva, K Tsuchiya, LG Pedroni, M Taya, MT Connor, NG Sahoo, P Wang, P-C Ma, P. Costa, R. Simoes, S Kirkpatrick, S Sreenivasan, S. Lanceros-Méndez, TA Huy, V Ambegaokar, V. Sencadas   +33 more
core   +1 more source

Piezoresistance in polysilicon

Electronics Letters, 1984
A theoretical model for piezoresistance in polysilicon is described. Grain size, orientation and doping dependence effects are included. Predictions of gauge factor using the model give reasonable agreement with experimental results and enable optimum processing parameters to be chosen for a given grain size.
French, PJ, Evans, A G R
openaire   +1 more source

Smarter Sensors Through Machine Learning: Historical Insights and Emerging Trends across Sensor Technologies

Advanced Functional Materials, EarlyView.
This review highlights how machine learning (ML) algorithms are employed to enhance sensor performance, focusing on gas and physical sensors such as haptic and strain devices. By addressing current bottlenecks and enabling simultaneous improvement of multiple metrics, these approaches pave the way toward next‐generation, real‐world sensor applications.
Kichul Lee, Osman Gul, Yeongjae Kwon, Jaeseok Jeong, Seokjoo Cho, Jihyeon Ahn, Jehee Yu, Cheolmin Kim, Donho Lee, Hyeonseok Han, Byeongju Lee, Jungrak Choi, Ji‐Hwan Ha, Yongrok Jeong, Kyungnam Kang, Ali Javey, Junseong Ahn, Inkyu Park   +17 more
wiley   +1 more source

Evaluation of the Piezoresistivity of a Thin Film of ZnO Doped with Fluorine and Deposited via the Ultrasonic Spray Pyrolysis Technique for Applications in Micro/Nano-Electromechanical Sensors

Crystals, 2022
In this study, thin films of zinc oxide doped with fluorine ZnO: F were deposited via ultrasonic spray pyrolysis (USP) with an atomic ratio of [F/Zn] in a starting solution of 15 at.% on borosilicate glass coverslips and SiO2/Si substrates. The structure,
Héctor Eduardo Petlacalco Ramírez, Salvador Alcántara Iniesta, Blanca Susana Soto Cruz, Jesús Israel Mejía Silva   +3 more
doaj   +1 more source

Controlling the dynamic percolation of carbon nanotube based conductive polymer composites by addition of secondary nanofillers: The effect on electrical conductivity and tuneable sensing behaviour [PDF]

, 2013
In this paper, the electrical properties of ternary nanocomposites based on thermoplastic polyurethane (TPU) and multi-walled carbon nanotubes (MWCNTs) are studied.
Alig, Bao, Bilotti, Bilotti, Bilotti, Bilotti, Bilotti, Blighe, Bryning, Cipriano, Coleman, Connolly, Deng, Deng, Dubois, Emiliano Bilotti, Feller, Gao, Grimaldi, Grunlan, Han Zhang, Hapuarachchi, Hone, Hua Deng, Huang, Jackson, Kasaliwal, Kashiwagi, Kim, Konishi, Kumar, Liu, Ma, Moreira, Morishita, Obrzut, Oliva-Aviles, Park, Qiang Fu, Radushkevich, Ramasubramaniam, Razal, Razdan, Rui Zhang, Sandler, Sumfleth, Sumfleth, Sun, Tans, Thostenson, Ton Peijs, Villmow, Wang, Wu, Wu, Yao, Zanetti, Zhang, Zhang, Zhang, Zhang   +60 more
core   +2 more sources

Piezoresistive Polymer Accelerometer

Procedia Engineering, 2014
AbstractThe fabrication and experimental characterization of a microinjection molded piezoresistive polymer accelerometer is presented here. The simplicity and low-cost of the fabrication process are a major advantage of the proposed alternative for the fabrication of microaccelerometers.
Martins, L.F., Silva, C.S., Mendes, B., Azevedo, M., Pontes, A.J., Rocha, L.A.   +5 more
openaire   +1 more source

Mechanotransducing Organic Electrochemical Diode for Crosstalk‐Inhibited Artificial Skin

Advanced Functional Materials, EarlyView.
An innovative approach is presented to a stretchable mechanotransducing diode that unifies rectification and tactile‐sensing functionality. This approach enables to fabricate the diode that maintains a large rectification ratio (5 × 102) at a high operational frequency (100 Hz).
Taeyeong Kim, Seunggoo Baek, Garrett Lecroy, Hyeongseok Choi, Wonjeong Suh, Woosung Cho, Alberto Salleo, Unyong Jeong   +7 more
wiley   +1 more source

Selection Strategies for Flexible Pressure Sensor Electrode Materials Toward Ultrafast Response

Advanced Functional Materials, EarlyView.
This study reveals, for the first time, how the electrode–organic interface governs the temporal performance of flexible pressure sensors. By pairing high‐conductivity CVD PEDOT with commonly used metal electrodes, the authors demonstrate that interfacial energy alignment dictates microsecond‐scale response, providing a straightforward design strategy ...
Jinwook Baek, Yuxuan Zhang, Hyeondong Yang, Minyoung Kim, Pavlos P. Vlachos, Jeongok Choe, Bo‐Gyu Bok, Kejie Zhao, Han‐Wook Song, Min‐Seok Kim, Martin Byung‐Guk Jun, Sunghwan Lee   +11 more
wiley   +1 more source

Characterization Of Thermal Stresses And Plasticity In Through-Silicon Via Structures For Three-Dimensional Integration [PDF]

, 2014
Through-silicon via (TSV) is a critical element connecting stacked dies in three-dimensional (3D) integration. The mismatch of thermal expansion coefficients between the Cu via and Si can generate significant stresses in the TSV structure to cause ...
Ho, P. S., Huang, R., Im, J., Jiang, T. F., Ryu, S. K.   +4 more
core   +1 more source