Results 41 to 50 of about 635 (199)

Wafer Level Packaging Technology Applied to Pixel Detectors

Frontiers in Physics, 2021
Pixel technology is commonly used in the tracking systems of High Energy Physics detectors with physical areas that have largely increased in the last decades.
Paolo Conci, Giovanni Darbo, Andrea Gaudiello, Andrea Gaudiello, Claudia Gemme, Stefano Girardi, Alessandro Lapertosa, Alessandro Lapertosa, Francesca Mattedi, Alessio Volpe   +9 more
doaj   +1 more source

Deep Learning Pose Estimation for Phenotyping of Co‐Occurring Hyperkinetic Movement Disorders

Annals of Clinical and Translational Neurology, EarlyView.
ABSTRACT Objective To explore whether routine outpatient video combined with deep learning‐based pose estimation and clinically interpretable kinematic features can support multi‐label phenotyping of co‐occurring hyperkinetic movement disorders (HMDs).
Laura Cif, Diane Demailly, Gabriella A. Horvàth, Juan Dario Ortigoza Escobar, Nathalie Dorison, Mayté Castro Jiménez, Cécile A. Hubsch, Thomas Wirth, Gun‐Marie Hariz, Sophie Huby, Morgan Dornadic, Zohra Souei, Muhammad Mushhood Ur Rehman, Simone Hemm, Mehdi Boulaymen, Eduardo M. Moraud, Jocelyne Bloch, Xavier Vasques   +17 more
wiley   +1 more source

Characterization of Defect Distribution in an Additively Manufactured AlSi10Mg as a Function of Processing Parameters and Correlations with Extreme Value Statistics

Advanced Engineering Materials, EarlyView.
Predicting extreme defects in additive manufacturing remains a key challenge limiting its structural reliability. This study proposes a statistical framework that integrates Extreme Value Theory with advanced process indicators to explore defect–process relationships and improve the estimation of critical defect sizes. The approach provides a basis for
Muhammad Muteeb Butt, Varma Kvvssn, Hossein Laieghi, Zia Uddin, Peyman Ansari, E. Kıvanç Sadak, Can Barış Toprak, Hüseyin Kızıl, Enrico Salvati   +8 more
wiley   +1 more source

Multimodal Data‐Driven Microstructure Characterization

Advanced Engineering Materials, EarlyView.
A self‐consistent autonomous workflow for EBSP‐based microstructure segmentation by integrating PCA, GMM clustering, and cNMF with information‐theoretic parameter selection, requiring no user input. An optimal ROI size related to characteristic grain size is identified.
Qi Zhang, Santiago Benito, Özge Özgün, Sebastian Weber, Markus Stricker   +4 more
wiley   +1 more source

High‐Temperature Nanoindentation of Metals: Assessing Thermal Drift, Frame Compliance, and Chemical Composition Effects on the Reported Mechanical Properties

Advanced Engineering Materials, EarlyView.
Do not let thermal drift and instrument artifacts deceive high‐temperature nanoindentation results. We compare classical Oliver–Pharr and automatic image recognition analyses across steels and a Ni alloy to quantify these effects. Accounting for artifacts reveals systematic softening with temperature, while Cr and Ni additions boost resistance ...
Velislava Yonkova, Steffen Brinckmann, Ruth Schwaiger   +2 more
wiley   +1 more source

Sub-Pixel Displacement Measurement with Swin Transformer: A Three-Level Classification Approach

Applied Sciences
In order to avoid the dependence of traditional sub-pixel displacement methods on interpolation method calculation, image gradient calculation, initial value estimation and iterative calculation, a Swin Transformer-based sub-pixel displacement ...
Yongxing Lin, Xiaoyan Xu, Zhixin Tie
doaj   +1 more source

Microstructure Reconstruction in Battery Electrodes Using Machine Learning Based on Low‐Voltage Focused Ion Beam–Scanning Electron Microscopy Tomography Images

Advanced Engineering Materials, EarlyView.
Low‐voltage FIB‐SEM tomography combined with a image preprocessing pipeline improves phase contrast and enables reliable machine‐learning segmentation of conductive networks in lithium‐ion battery electrodes. Structural descriptors are extracted from segmented images, done semimanually and automated, and compared.
Lisa Beran, Vincent Nebel, Dominik Perius, Kshitij Kumar, Yannis Heim, Laura Bies, Tobias Kraus   +6 more
wiley   +1 more source

Dynamic range expansion of active pixel sensor with output voltage feedback [PDF]

Journal of Sensor Science and Technology, 2009
In this paper, a wide dynamic range active pixel sensor(APS) with output voltage feedback structure has been designed by a 2-poly 4-metal 0.35 m standard CMOS technology. We presented a novel APS with output voltage feedback, which exhibits a wide dynamic range.
Min-Woong Seo, Sang-Ho Seo, Jae-Sung Kong, Jang-Kyoo Shin   +3 more
openaire   +1 more source

Advanced Electron Microscopy and Microcomputed Tomography Analysis of Single‐Crystal Ni‐Base Superalloys After Short‐Term Multiaxial Creep

Advanced Engineering Materials, EarlyView.
This work studies the anisotropic behavior of circular notched tensile specimens of Ni‐base superalloy single crystals during high‐temperature tensile creep along [001], [110], and [111]. Correlative scale‐bridging imaging of specimens reveals early rupture along [110] because 1) plastic deformation proceeds faster at notch center; 2) more (brittle ...
Leonardo Agudo Jácome, Lijie Cao, Christoph Somsen, Johannes Boes, René Hesse, Werner Theisen, Gunther Eggeler   +6 more
wiley   +1 more source

A Practical Noise2Noise Denoising Pipeline for High‐Throughput Raman Spectroscopy

Advanced Engineering Materials, EarlyView.
A lightweight and reproducible denoising pipeline for high‐throughput Raman spectroscopy is introduced, based on a 1D convolutional autoencoder trained with a Noise2Noise strategy. Using only repeated short‐exposure acquisitions, the method suppresses stochastic noise without reference spectra, enabling reliable spectral reconstruction while preserving
David Martin‐Calle, Cesar Alvarez‐Llamas, Vincent Motto‐Ros, Christophe Dujardin, Jérémie Margueritat, David Rodney   +5 more
wiley   +1 more source