Results 61 to 70 of about 23,182 (295)

Beyond level planarity

, 2016
In this paper we settle the computational complexity of two open problems related to the extension of the notion of level planarity to surfaces different from the plane. Namely, we show that the problems of testing the existence of a level embedding of a
Frati, F., DA LOZZO, GIORDANO, Giuseppe Di Battista, Di Battista, G., FRATI, FABRIZIO, Giordano Da Lozzo, ANGELINI, PATRIZIO, Patrignani, M., Ignaz Rutter, PATRIGNANI, Maurizio, Fabrizio Frati, Da Lozzo, G., Rutter, I., Maurizio Patrignani, DI BATTISTA, Giuseppe, Rutter, Ignaz, Patrizio Angelini, Partignani, Maurizio, Angelini, P.   +18 more
core   +1 more source

Planar Retroreflector [PDF]

CLEO: 2014, 2014
We propose a planar retroreflector composed of two cascaded high contrast periodic structures with slowly varying features. One of the high contrast structures focuses the light while the other reflects it as a concave mirror.
Arbabi, Amir, Horie, Yu, Faraon, Andrei
openaire   +2 more sources

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

Advanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz, Jonas Fell, Hendrik Jost, Stefan Diebels, Hans‐Georg Herrmann   +4 more
wiley   +1 more source

Planar quorums

Theoretical Computer Science, 1996
zbMATH Open Web Interface contents unavailable due to conflicting licenses.
openaire   +4 more sources

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Planarity ranks for varieties of equationally noetherian semigroups [PDF]

Известия Саратовского университета. Новая серия: Математика. Механика. Информатика
The problem of describing semigroup varieties with finite planarity rank is researched. In addition to the previously obtained results the author finds new countable infinite series of semigroup varieties with finite planarity rank.
Solomatin, Denis Vladimirovich
doaj   +1 more source

Design and testing of a centrifugal fluidic device for populating microarrays of spheroid cancer cell cultures

Journal of Biological Engineering, 2020
Background In current cancer spheroid culturing methods, the transfer and histological processing of specimens grown in 96-well plates is a time consuming process.
Warren Weisler, Samuel Miller, Shaphan Jernigan, Gregory Buckner, Matthew Bryant   +4 more
doaj   +1 more source

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

Advanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

Radial Level Planarity Testing and Embedding in Linear Time

Journal of Graph Algorithms and Applications, 2005
A graph with an ordered k-partition of the vertices is radial level planar if there is a strictly outward drawing on k concentric levels without crossings.
Christian Bachmaier, Franz Brandenburg, Michael Forster   +2 more
doaj   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source