Results 181 to 190 of about 355,686 (307)

Constructive Solid Geometry

, 1977
The term'constructive solid geometry'denotes a class of schemes for describing solid objects as compositions (usually'additions'and'subtractions') of primitive solid'building blocks.'The notion of adding and subtracting solids has been used by mechanical
A. Requicha, H.B. Voelcker
core  

Slip Localization Intensification Mediated by Grain Boundary Sliding in a Polycrystalline Nickel‐Based Superalloy

Advanced Engineering Materials, EarlyView.
The temperature dependence of fatigue behavior in nickel‐based superalloys is investigated through high‐resolution measurements of plastic localization. While increasing temperature reduces localization and enhances fatigue performance in René 88DT, Inconel 718 exhibits a sharp degradation at intermediate temperature due to intensified slip ...
M. Calvat, D. Anjaria, I. Woo, C. Bean, D. Texier, J. C. Stinville   +5 more
wiley   +1 more source

Passive seismological approaches for localizing near-surface fiber-optic cables with DAS. [PDF]

Sci Rep
Rümpker G, Limberger F, Komeazi A.
europepmc   +1 more source

Fatigue Crack Initiation and Growth in Nanocrystalline Ni at Multiple Length‐Scales

Advanced Engineering Materials, EarlyView.
Overview of miniaturized in situ SEM fatigue setup and resultant fatigue crack growth data for nanocrystalline Ni. The presented study focuses on the analysis of fatigue crack growth rate (FCGR) in focused ion beam‐notched microcantilevers prepared from nanocrystalline (NC) Ni as a model material.
Igor Moravcik, Alexander Jelinek, Markus Alfreider, Jutta Luksch, Anton Hohenwarter, Florian Schaefer, Christian Motz, Daniel Kiener   +7 more
wiley   +1 more source

Structure-Preserving Point Cloud Completion with Symmetry-Guided Progressive Refinement. [PDF]

Sensors (Basel)
Zhao S, Niu Y.
europepmc   +1 more source

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

Advanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad, Aleksander Kostka, Gowtham Arivanandhan, Yujiao Li, Alan Savan, Manfred Kohl, Alfred Ludwig   +6 more
wiley   +1 more source

Geometry and Surface Feature Evaluation in E-PBF Process Using In-Operando Electron Emission Signal. [PDF]

Materials (Basel)
Alfaifi A, Alshammery OA, Truong TD, You H, Taheri Andani M.   +4 more
europepmc   +1 more source

A Lightweight Procedural Layer for Hybrid Experimental–Computational Workflows in Materials Science

Advanced Engineering Materials, EarlyView.
We unveil a prototype hybrid‐workflow framework that fuses automatedcomputation with hands‐on experiments. Built atop pyiron, a lightweight, parameterized layer translates procedure descriptions into executable manual steps, syncing instrument settings, human interventions, and data capture in real‐time today.
Steffen Brinckmann, Sarath Menon, Raphael Röske, Johannes Steinhülb, Michael Selzer, Jan Janssen, Tilmann Hickel, Ruth Schwaiger, Jörg Neugebauer   +8 more
wiley   +1 more source

LiDAR-Free 3D Auto-Labeling via Radar-Visual Spatio-Temporal Consistency. [PDF]

Sensors (Basel)
Zhu B, Hu Z, Lu Z.
europepmc   +1 more source

Creep‐Induced Microstructural Evolution in an A2‐B2 Superalloy

Advanced Engineering Materials, EarlyView.
A 27.3Ta‐27.3Mo‐27.3Ti‐8Cr‐10Al (at.%) refractory high‐entropy alloy with precipitation‐strengthened A2‐B2 microstructure was studied by creep tests at 1030°C, which demonstrate a transition in deformation mechanisms in the range of 100–150 MPa applied stress. This is associated with changes in dislocation–precipitate interactions. Relevant deformation
Liu Yang, Aparajita Pramanik, Sandipan Sen, Shubhashis Dixit, Marcel Muench, R. J. Vikram, Daniel Schliephake, Yolita M. Eggeler, Ankur Chauhan, Martin Heilmaier, Alexander Kauffmann   +10 more
wiley   +1 more source