Results 271 to 280 of about 7,600,413 (382)

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli

open access: yesAdvanced Engineering Materials, EarlyView.
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley   +1 more source

Additive Manufacturing of Gradient Stiffness Honeycombs Using Thermoplastic Polyurethane Composite Material Variations

open access: yesAdvanced Engineering Materials, EarlyView.
By combining porous, solid, and carbon fiber‐reinforced thermoplastic polyurethane within a single 3D printed honeycomb structure, this current work achieved precise control over spatial stiffness while ensuring strong interlayer adhesion. The findings demonstrate enhanced energy absorption and densification strain, outperforming traditional uniform ...
Savvas Koltsakidis   +2 more
wiley   +1 more source

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