Results 201 to 210 of about 848,796 (301)
Non-polar nanocluster confinement engineering realizes high capacitive energy storage in Pb-free high-entropy relaxors. [PDF]
Xie A +12 more
europepmc +1 more source
Powder Optimization Strategies for Binder Jetting Printing of BaTiO3 and Ba0,6Sr0,4TiO3 Ceramics
Powder optimization is investigated to enable binder jetting of BaTiO3 and Ba0.6Sr0.4TiO3 ferroelectric ceramics. The antagonistic relationship between flowability and binder compatibility is addressed through binder impregnation of granulated powders and fumed silica addition to fine powders.
Fanny Pruvost +4 more
wiley +1 more source
Precise structure and polarization determination of Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> with electron ptychography. [PDF]
Gao X +12 more
europepmc +1 more source
Influence of an Oxygen‐Free Atmosphere on Diamond‐Single‐Grain Scratching of Ti–6Al–4V
Single‐grain scratching of Ti–6Al–4V is investigated under controlled, oxygen‐free, and ambient atmospheres using a novel experimental setup with in situ high‐speed imaging. The approach enables direct observation of chip formation and adhesion under suppressed oxidation.
Berend Denkena +2 more
wiley +1 more source
Toward Sustainable Printed Packaging: Surface Properties and Ink Adhesion Behavior of PLA/PCL/Nanosilica Biopolymer Blends. [PDF]
Mahović Poljaček S +2 more
europepmc +1 more source
This study investigates laser‐based oxide removal of Cu inserts in oxygen‐free conditions and examines long‐term oxidation kinetics and surface chemistry under different atmospheres via X‐ray photoelectron spectroscopy. Al–Cu compound casting with differently oxidized surfaces is performed, and intermetallic phase formation, morphology, and thermal ...
Timon Steinhoff +9 more
wiley +1 more source
Direct Laser Interference Patterning for Wettability Modification and Bubble Nucleation on Conventional and Additively Manufactured Metals. [PDF]
Heinrich J +8 more
europepmc +1 more source
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu +8 more
wiley +1 more source

