Results 301 to 310 of about 1,020,253 (390)

Light‐Emitting Diodes Based on Metal Halide Perovskite and Perovskite Related Nanocrystals

open access: yesAdvanced Materials, EarlyView.
The review covers the past and current developments in light‐emitting diodes (LEDs) exploiting nanocrystals of halide perovskites and perovskite‐related materials. The review examines the aspects of material optimizations, device engineering, and applications.
Ying Liu   +7 more
wiley   +1 more source

Unusual presentation of polyethylene tibial fracture in a polio patient: a case report. [PDF]

open access: yesJ Surg Case Rep
Alsheikh KA   +4 more
europepmc   +1 more source

Van Der Waals Hybrid Integration of 2D Semimetals for Broadband Photodetection

open access: yesAdvanced Materials, EarlyView.
Advanced broadband photodetector technologies are essential for military and civilian applications. 2D semimetals, with their gapless band structures, high mobility, and topological protection, offer great promise for broadband PDs. This study reviews the latest advancements in broadband PDs utilizing heterostructures that combine 2D semimetals with ...
Xue Li   +9 more
wiley   +1 more source

From Mechanoelectric Conversion to Tissue Regeneration: Translational Progress in Piezoelectric Materials

open access: yesAdvanced Materials, EarlyView.
This review highlights recent progress in piezoelectric materials for regenerative medicine, emphasizing their ability to convert mechanical stimuli into bioelectric signals that promote tissue repair. Key discussions cover the intrinsic piezoelectric properties of biological tissues, co‐stimulation cellular mechanisms for tissue regeneration, and ...
Xinyu Wang   +3 more
wiley   +1 more source

Modeling the Kinetics of Polyethylene Terephthalate and Polyesters with Terminal Hydroxyl Groups Transesterification Reactions. [PDF]

open access: yesPolymers (Basel)
Kirshanov KA   +7 more
europepmc   +1 more source

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

open access: yesAdvanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa   +9 more
wiley   +1 more source

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