Radiation Induced Graft Copolymerization of Styrene to Polyethylene Single Crystal Aggregate Film
T. Takamatsu+2 more
openalex +2 more sources
Light‐Emitting Diodes Based on Metal Halide Perovskite and Perovskite Related Nanocrystals
The review covers the past and current developments in light‐emitting diodes (LEDs) exploiting nanocrystals of halide perovskites and perovskite‐related materials. The review examines the aspects of material optimizations, device engineering, and applications.
Ying Liu+7 more
wiley +1 more source
Unusual presentation of polyethylene tibial fracture in a polio patient: a case report. [PDF]
Alsheikh KA+4 more
europepmc +1 more source
Melting temperature and change of lamellar thickness with time for bulk polyethylene
James J. Weeks
openalex +1 more source
Van Der Waals Hybrid Integration of 2D Semimetals for Broadband Photodetection
Advanced broadband photodetector technologies are essential for military and civilian applications. 2D semimetals, with their gapless band structures, high mobility, and topological protection, offer great promise for broadband PDs. This study reviews the latest advancements in broadband PDs utilizing heterostructures that combine 2D semimetals with ...
Xue Li+9 more
wiley +1 more source
Articulating Materials Are Determinants of Survivorship of Hip Arthroplasties Performed for Nontraumatic Osteonecrosis of the Femoral Head. [PDF]
Kobayashi S+5 more
europepmc +1 more source
This review highlights recent progress in piezoelectric materials for regenerative medicine, emphasizing their ability to convert mechanical stimuli into bioelectric signals that promote tissue repair. Key discussions cover the intrinsic piezoelectric properties of biological tissues, co‐stimulation cellular mechanisms for tissue regeneration, and ...
Xinyu Wang+3 more
wiley +1 more source
Modeling the Kinetics of Polyethylene Terephthalate and Polyesters with Terminal Hydroxyl Groups Transesterification Reactions. [PDF]
Kirshanov KA+7 more
europepmc +1 more source
Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa+9 more
wiley +1 more source