Results 201 to 210 of about 225,323 (289)

Upcycling of Ethylene-Vinyl Acetate Copolymer Through Hydrolysis and Reactive-Filling into Polyurethane Resins [PDF]

open access: bronze
D. Kumar   +4 more
openalex   +1 more source

Recyclable and Binder‐Free EGaIn–Carbon Liquid Metal Composite: A Sustainable Approach for High‐Performance Stretchable Electronics, Thermal‐Interfacing and EMI‐Shielding

open access: yesAdvanced Materials Technologies, EarlyView.
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini   +4 more
wiley   +1 more source

Hydrogel‐Based Functional Materials: Classifications, Properties, and Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Conductive hydrogels have emerged as promising materials for smart wearable devices due to their outstanding flexibility, multifunctionality, and biocompatibility. This review systematically summarizes recent progress in their design strategies, focusing on monomer systems and conductive components, and highlights key multifunctional properties such as
Zeyu Zhang, Zao Cheng, Patrizio Raffa
wiley   +1 more source

Preparation and Performance Study of Silicone-Oligomer Composite-Modified Polyurethane Sealant. [PDF]

open access: yesPolymers (Basel)
Li N   +8 more
europepmc   +1 more source

Adhesive Double‐Network Granular Organogel E‐Skin

open access: yesAdvanced Materials Technologies, EarlyView.
We introduce a double‐network granular organogel adhesive for electronic skin, overcoming adhesion and strength trade‐offs. It provides reversible, robust bonding and ionic conductivity, enabling wearable and soft robotic e‐skin. Thanks to the e‐skin adhesive, a soft robotic trunk can recognize touch, temperature, humidity, and acidity.
Antonia Georgopoulou   +4 more
wiley   +1 more source

Submicron Patterning Techniques for Perovskite Optoelectronics From Materials Challenges to Scalable Device Integration

open access: yesAdvanced Optical Materials, EarlyView.
This review highlights submicron patterning strategies for metal halide perovskites, focusing on solvent compatibility, resolution, and alignment toward scalable integration in advanced optoelectronic systems. Abstract Halide perovskites are promising materials for future optoelectronic and display systems.
Dante Ahn   +4 more
wiley   +1 more source

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