Results 61 to 70 of about 103,541 (257)
Planar Solid‐State Nanopores Toward Scalable Nanofluidic Integration Based on CMOS Technology
Advanced Engineering Materials, EarlyView.We present a scalable silicon‐based fabrication strategy for planar solid‐state nanopores to enable their integration with complex nanofluidic systems. Prototype devices demonstrate normal voltage‐current characteristics, good noise performance, and appreciable streaming currents. Our CMOS‐compatible fabrication process offers precise geometric control
Ngan Hoang Pham +7 more
wiley +1 more source
Theory and optimisation of double conversion heterodyne photoparametric amplifier [PDF]
An optical wireless transmission technique represents an attractive choice for many indoor and outdoors applications within fixed and mobile networks. It has the advantage of providing a wide bandwidth that is unregulated worldwide, with availability ...
Alhagagi, Hussam A.
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Advanced Engineering Materials, EarlyView.This study explores the lightweight potential of laser additive‐manufactured NiTi triply periodic minimal surface sheet lattices. It systematically investigates the effects of relative density and unit cell size on surface quality, deformation recovery, compression behavior, and energy absorption.
Haoming Mo +3 more
wiley +1 more source
Design of a Radiofrequency Power Amplifier in a 16nm-FinFET technology
embargoed_20271015In this work of thesis a design a pseudo-differential Radiofrequency Power Amplifier in a 16nmFinFET technology by Intel® is presented.
PIACENZA, CARLO
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Power network in the loop : subsystem testing using a switching amplifier
, 2009 “Hardware in the Loop” (HIL) testing is widely used in the automotive industry. The sophisticated electronic control units used for vehicle control are usually tested and evaluated using HIL-simulations.
Goyal, Sachin
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Advanced Engineering Materials, EarlyView.Low‐cycle fatigue damage in Mn–Mo–Ni reactor pressure vessel steel is examined using a combined electron backscatter diffraction and positron annihilation lifetime spectroscopy approach. The study correlates texture evolution, dislocation substructure development, and vacancy‐type defect formation across uniform, necked, and fracture regions, providing
Apu Sarkar +2 more
wiley +1 more source
AIGaN/GaN HEMTs Power Amplifier MIC with Power Combining at C-Band
, 2007 A power amplifier MIC with power combining based on AlGaN/GaN HEMTs was fabricated and measured. The amplifier consists of four 10×120μm transistors. A Wilkinson splitters and combining were used to divide and combine the power.
Yao Xiaojiang +10 more
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Advanced Engineering Materials, EarlyView.Geometry‐driven thermal behavior in wire‐arc additive manufacturing (WAAM) influences microstructural evolution during nonequilibrium solidification of a chemically complex Fe–Cr–Nb–W–Mo–C nanocomposite system. By comparing different deposits configurations, distinct entropy–cooling rate correlations, segregation, and carbide evolution are revealed ...
Blanca Palacios +5 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.This article presents the design, modeling, and characterization of air‐pressure–actuated programmable vibroacoustic metamaterials (PVAMM). The study focuses on leveraging air pressure to dynamically tune resonance frequencies for effective noise attenuation.
William Kaal +2 more
wiley +1 more source
CMOS/SiGe BiCMOS 2.4GHz RF Power Amplifier on PCB Module
, 2007 在本論文中，我們介紹了功率放大器基本設計概念與流程。此外，本論文設計與製作了數個應用於IEEE 802.11b/g無線網路通訊協定，以金氧半與矽鍺製程製作的2.4GHz的無線功率放大器。以0.25微米金氧半製程製作的功率放大器，達成了26 dB的線性增益，21.8dBm的飽和功率，18.5dBm的1dB增益壓縮點以及23%的最大功率增加效率。對於0.18微米金氧半功率放大器，經由偏壓控制電路對線性度的改善，1dB增益壓縮點增加了1.3dBm。以0.35微米矽鍺製程製作的功率放大器，達成了27.6 ...
Lai, Hung Hui, 賴宏諱
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