Results 41 to 50 of about 5,208,445 (245)

Magnetic Properties of Magnetic Nanoparticles for Efficient Hyperthermia

Nanomaterials, 2015
Localized magnetic hyperthermia using magnetic nanoparticles (MNPs) under the application of small magnetic fields is a promising tool for treating small or deep-seated tumors.
Ihab M. Obaidat, Bashar Issa, Yousef Haik   +2 more
doaj   +1 more source

Design Time Temperature Reduction in Mixed Polarity Dual Reed-Muller Network: a NSGA-II Based Approach

Advances in Electrical and Computer Engineering, 2020
Proposed work addresses the existing thermal problem of OR-XNOR based circuit by introducing design time thermal management technique at the logic level. The approach is used to reduce the peak temperature by eliminating local hotspots.
DAS, A., PRADHAN, S. N.
doaj   +1 more source

Wave dissipation by flexible vegetation [PDF]

, 2011
Dissipation of waves propagating through natural salt marsh vegetation was about half the dissipation expected for rigid vegetation. This low dissipation was predicted by a theoretical model that accounts for bending of vegetation by wave motions.
Riffe, Kassi C., Stephen M. Henderson, Mullarney, Julia C., Mullarney, Julia C, Kassi C. Riffe, Henderson, Stephen M, Julia C. Mullarney, Henderson, Stephen M., Riffe, Kassi C   +8 more
core   +1 more source

Influence of Scan Strategies in Electron Beam Powder Bed Fusion on Solidification, Microstructure, and High‐Temperature Compressive Properties of γ′‐Strengthened Inconel 738LC

Advanced Engineering Materials, EarlyView.
Experiments and thermophysical simulations were conducted to investigate the electron beam powder bed fusion electron beam (PBF‐EB/M) process for the γ′‐strengthened nickel‐based superalloy Inconel 738LC. The results demonstrate the impact of process‐induced microstructural variations on high‐temperature mechanical behavior, providing a basis for ...
Jan Niklas Petenati, Karthik Kumar Banku, Prasanth Bondi, Ivan Zhirnov, Yangyiwei Yang, Gordon Schmidt, Jürgen Christen, Georg Hasemann, Manja Krüger, Bai‐Xiang Xu, Bilal Gökce, Silja‐Katharina Rittinghaus   +11 more
wiley   +1 more source

Analysis and Verification of Heat Dissipation Structures Embedded in Substrates in Power Chips Based on Square Frustums Thermal through Silicon Vias

Micromachines
A novel heat dissipation structure composed of square frustums thermal through silicon via array and embedded in P-type (100) silicon substrate is proposed to improve the heat dissipation capacity of power chips while reducing process difficulty.
Fengjie Guo, Kui Ma, Jingyang Ran, Fashun Yang   +3 more
doaj   +1 more source

Design of Low Power DFF with ONOFIC Approach [PDF]

Journal of Electrical and Electronics Engineering, 2020
In today’s world as the need of memory elements with high performance are highly demanded, so flip flops came into existence. The flip flops have many applications in the field of electronics.
MALIK Masood Ahmad, SHARMA Vijay Kumar
doaj  

Pollution Flashover Under Different Contamination Profiles on High Voltage Insulator: Numerical and Experiment Investigation

IEEE Access, 2021
This work aimed to study the influence of contamination profiles and humidity on flashover electrical characteristics of polluted insulators. Firstly, the flashover tests on cap and pin glass insulators under four pollution levels represented by salinity
Ali Ahmed Salem, R. Abd-Rahman, Wan Rahiman, Samir Ahmed Al-Gailani, Salem Mgammal Al-Ameri, Mohd Taufiq Ishak, Usman Ullah Sheikh   +6 more
doaj   +1 more source

Investigating the Effect of Inclination Angle and the Influence of Scan Parameters on the Appearance and Thermal and Mechanical Properties of Filigree Tension Rods of LPBF‐Manufactured NiTi Shape‐Memory Alloys

Advanced Engineering Materials, EarlyView.
This article investigates the dependence of the properties on the manufacturing orientation in the form of the inclination angle to the build plate of LPBF‐fabricated NiTi rods with a diameter of 150–220 µm. Metallographic, chemical, thermal, and mechanical characterization show behavior under identical manufacturing conditions that ranges from ...
Sandra Herzig, Michael Werner, Christian Rotsch   +2 more
wiley   +1 more source

Scan architecture with mutually exclusive scan segment activation for shift and capture power reduction

, 2004
Power dissipation during scan testing is becoming an important concern as design sizes and gate densities increase. While several approaches have been recently proposed for reducing power dissipation during the shift cycle (minimum transition don't care ...
Rosinger, Paul, Al-Hashimi, Bashir, Nicolici, Nicola   +2 more
core   +1 more source

Enhancement of Natural Convection Heat Transfer from a Fin by Circular Perforations

Zhileng xuebao, 2012
Heat transfer enhancement from a horizontal rectangular fin embedded with circular perforations under natural convection is studied. Through the experiment and simulation, the heat dissipation power of different perforated numbers was compared to the ...
Jing Wenjuan, Jian Shizhao, Yin Shugui, Wei Xinli   +3 more
doaj