Results 91 to 100 of about 319,189 (309)
The demonstration of the complementary integrated circuit using printing processes is indispensable for realizing electronic devices using organic thin film transistors.
Yasunori Takeda +6 more
doaj +1 more source
AIN-Based Packaging for SiC High-Temperature Electronics [PDF]
Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be ...
Savrun, Ender
core +1 more source
A Survey of Memristive Threshold Logic Circuits
In this paper, we review the different memristive threshold logic (MTL) circuits that are inspired from the synaptic action of flow of neurotransmitters in the biological brain.
James, Alex Pappachen +2 more
core +1 more source
The dielectric properties of clays are studied on the level of individual monolayers and functional double stacks. The material breakdown characteristics and charge storage performance are analyzed. For illustration, a defined charge pattern representing a cuneiform character is produced, written into a microscopic clay tile, referencing the origins of
Sebastian Gödrich +6 more
wiley +1 more source
Modeling Nonlinear Inductor, Resistor, and Buck Converter Using NARX Neural Network
This study investigates the methodology of using the capability of Artificial Neural Networks (ANNs) as an alternative approach for modeling nonlinear inductors, nonlinear resistors, and power electronic circuits in electrical power systems.
Hayder D. Almukhtar +2 more
doaj +1 more source
The integration of photovoltaic (PV) systems into building structures introduces distinct fire risks with critical implications for occupant safety. This review examines the key fire hazards associated with PV implementation and explores mitigation strategies, including flame‐retardant additives.
Florian Ollagnon +7 more
wiley +1 more source
Study on the Technology and Properties of Green Laser Sintering Nano-Copper Paste Ink
With the rapid development of integrated circuits, glass substrates are frequently utilized for prototyping various functional electronic circuits due to their superior stability, transparency, and signal integrity.
Pengkun Li +6 more
doaj +1 more source
New approach to power semiconductor devices modeling
The main problems occurring during high power device modeling are discussed in this paper. Unipolar and bipolar device properties are compared and the problems concerning high time-constant values related to the diffusion phenomena in the large base are
Andrzej Napieralski +1 more
doaj +1 more source
Direct detection optical intersatellite link at 220 Mbps using AlGaAs laser diode and silicon APD with 4-ary PPM signaling [PDF]
A newly developed 220 Mbps free-space 4-ary pulse position modulation (PPM) direct detection optical communication system is described. High speed GaAs integrated circuits were used to construct the PPM encoder and receiver electronic circuits.
Davidson, Frederic M., Sun, Xiaoli
core +1 more source
Modulating Electrochemical CO2 Reduction Pathways via Interfacial Electric Field
Engineering interfacial electric fields in Cu/ITO electrodes enables precise control of CO2 reduction pathways. Charge transfer from Cu to ITO generates positively charged Cu species that steer selectivity from ethylene toward methane. This work demonstrates how interfacial electric‐field modulation can direct reaction intermediates and transform ...
Mahdi Salehi +7 more
wiley +1 more source

