Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications. [PDF]
Hlina J, Reboun J, Hamacek A.
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Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance. [PDF]
Sudhindra S, Kargar F, Balandin AA.
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Two-dimensional magnetic tunnel p-n junctions for low-power electronics. [PDF]
Zhu W +15 more
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Special Issue on Advanced Sensing and Control Technologies in Power Electronics. [PDF]
Bernacki K, Novak M.
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Design and implementation of a module for teaching and research on SCRs for power electronics. [PDF]
Bayona J, Gélvez N, Espitia H.
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Advances in High-Voltage Power Electronics Using Ga<sub>2</sub>O<sub>3</sub>-Based HEMT: Modeling. [PDF]
Alhasani R +4 more
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Electromagnetic dynamic stability analysis of power electronics-dominated systems using eigenstructure-preserved LTP Theory. [PDF]
Hu J +11 more
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Optimization of CuOx/Ga2O3 Heterojunction Diodes for High-Voltage Power Electronics. [PDF]
Wang X +13 more
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Dynamic Network Characteristics of Power-electronics-based Power Systems. [PDF]
Ji Y, He W, Cheng S, Kurths J, Zhan M.
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