Results 91 to 100 of about 138,271 (313)

Power Electronics Revolutionized: A Comprehensive Analysis of Emerging Wide and Ultrawide Bandgap Devices. [PDF]

Micromachines (Basel), 2023
Rafin SMSH, Ahmed R, Haque MA, Hossain MK, Haque MA, Mohammed OA.   +5 more
europepmc   +1 more source

Ultrasonic Atomization Spray Coating of PCL on an Mg‐Based Alloy Enhanced by Plasma Electrolytic Oxidation for Improved Adhesion, Corrosion Resistance, and Biocompatibility

Advanced Engineering Materials, EarlyView.
Plasma electrolytic oxidation is combined with ultrasonic spray deposition of polycaprolactone (PCL) on WE43 magnesium alloy to improve adhesion, corrosion resistance, and cytocompatibility. The hybrid coating demonstrates significantly reduced hydrogen evolution and enhances mechanical bonding, offering a promising strategy for next‐generation ...
Seyed Masih Mousavizadeh, Atiyeh Adelinia, Frederick D. Crowley, Jamal Seyyed Monfared Zanjani, John J. E. Mulvihill, Mingzhi Yu, Ehsan Rezvani, Matthijn de Rooij, Michael D. Gilchrist, Nan Zhang   +9 more
wiley   +1 more source

High efficiency three‐dimensional wireless power transfer system using cylindrical transmitting coil

IET Power Electronics
Three‐dimensional (3D) wireless power transfer (WPT) is an attractive methodology to improve the charging safety and flexibility of portable electronic equipment and to meet the charging demand brought by the increase of electronic equipment. Herein a 3D
Qingfeng Ma, Jiayi Xu, Shui Pang, Yehao Liu, HongYu Li, Xingfei Li   +5 more
doaj   +1 more source

An avalanche-and-surge robust ultrawide-bandgap heterojunction for power electronics. [PDF]

Nat Commun, 2023
Zhou F, Gong H, Xiao M, Ma Y, Wang Z, Yu X, Li L, Fu L, Tan HH, Yang Y, Ren FF, Gu S, Zheng Y, Lu H, Zhang R, Zhang Y, Ye J.   +16 more
europepmc   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Advanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke, John Wu, Alan L. Kastengren, Nikhilesh Chawla   +3 more
wiley   +1 more source

Power flow control in a modular converter with energy storage

IET Power Electronics
Using modularized power converters with scalable energy storage in particle accelerators can be further enhanced with controls that can be adapted to optimise different design targets, such as to minimise the front‐end stage peak current, the depth of ...
Krister Leonart Haugen, Konstantinos Papastergiou, Dimosthenis Peftitsis   +2 more
doaj   +1 more source

Real-Time Temperature Prediction of Power Devices Using an Improved Thermal Equivalent Circuit Model and Application in Power Electronics. [PDF]

Micromachines (Basel), 2023
Hu Z, Cui M, Wu X.
europepmc   +1 more source

Bioinspired Materials, Designs, and Manufacturing Strategies for Advanced Impact‐Resistant Helmets

Advanced Engineering Materials, EarlyView.
This review explores how bioinspired materials, structures, and manufacturing strategies transform helmet design to achieve enhanced impact resistance. Drawing inspiration from nacre, porcupine quills, beetle exoskeletons, and skull architectures, it highlights advances in auxetic lattices, nanocomposites, and functionally graded foams.
Joseph Schlager, Yi Jin, Mohammad Faruk, Jay Alberts, C. Chase Cao   +4 more
wiley   +1 more source

Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages. [PDF]

Materials (Basel), 2023
Mirone G, Barbagallo R, Bua G, La Rosa G.   +3 more
europepmc   +1 more source

3D‐Printable Near‐Infrared‐Responsive Microscale Cantilever made of the Composite Consisting of Ceramic Particles and Graphene Flakes

Advanced Engineering Materials, EarlyView.
A near infrared‐responsive microscale cantilever is developed using a 3D‐printable composite based on photocurable resin consisting of sepiolite and graphene flakes. The material absorbs 1064 nm light, causing shape transformation with an average displacement of 1.3 mm in 1.7 s. Displacement is measured via video recording.
Karolina Laszczyk, Weronika Chuda, Piotr Kamedulski, Damian Nowak   +3 more
wiley   +1 more source