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A Review of High-Speed GaN Power Modules: State of the Art, Challenges, and Solutions
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2023Wide bandgap (WBG) devices are a desirable choice for high-density energy conversion systems. In high-speed hard-switching applications, voltage overshoot across device terminals, oscillations at gate loop, and electromagnetic interference (EMI) become ...
A. Emon +5 more
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A Review of Electric Vehicle Auxiliary Power Modules: Challenges, Topologies, and Future Trends
IEEE transactions on power electronics, 2023The auxiliary power module (APM) is a vital component in electric vehicles (EVs) that enables efficient power transfer from the traction battery to low-voltage electrical loads and the 12 V battery.
Cun Wang, Pengfei Zheng, J. Bauman
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IEEE transactions on power electronics, 2023
Low-profile double-side cooled power modules are emerging in electric-drive inverters to achieve higher power density and efficiency. However, the rigid interconnection between the devices and two substrates raises the thermomechanical reliability issue ...
C. Ding +7 more
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Low-profile double-side cooled power modules are emerging in electric-drive inverters to achieve higher power density and efficiency. However, the rigid interconnection between the devices and two substrates raises the thermomechanical reliability issue ...
C. Ding +7 more
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IEEE transactions on power electronics, 2023
Multichip silicon carbide (SiC) power modules with Kelvin-source connections are commonly used in applications requiring large capacity. As a result of the parasitic effect induced by the interconnections in module packaging, the dynamic current mismatch
Y. Ge +5 more
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Multichip silicon carbide (SiC) power modules with Kelvin-source connections are commonly used in applications requiring large capacity. As a result of the parasitic effect induced by the interconnections in module packaging, the dynamic current mismatch
Y. Ge +5 more
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IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2023
Low conduction and switching loss silicon carbide power modules must be operated at higher maximum junction temperatures utilizing their wide bandgap material properties.
Kan Yasui +2 more
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Low conduction and switching loss silicon carbide power modules must be operated at higher maximum junction temperatures utilizing their wide bandgap material properties.
Kan Yasui +2 more
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Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles
IEEE transactions on device and materials reliability, 2023Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some typical double-
Panpan Lu +5 more
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Partial Discharge Behaviors in Power Modules Under Square Pulses With Ultrafast dv/dt
IEEE transactions on power electronics, 2021The unprecedented high-speed switching of wide bandgap power devices may change the partial discharge (PD) behaviors of power modules, busbars, and loads.
Haoyang You +5 more
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