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Reviewing Thermal-Monitoring Techniques for Smart Power Modules
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2022The increasing demand for higher power device utilization and reliability in power electronic systems is driving the integration of condition monitoring and active control in power electronic systems.
Sven Kalker +7 more
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High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2022The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of encapsulation materials, especially when operating temperatures ...
Hanyan Gao, Pan Liu
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State-of-Charge Balancing With Parallel and Series Output Connected Battery Power Modules
IEEE transactions on power electronics, 2022This article presents a new state-of-charge (SOC) balancing method with parallel and series output connected battery power modules (BPMs) in an active battery management system (BMS.) To increase both the battery pack and system-level modularity, the BMS
Mohamed Kamel +3 more
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Parasitic Inductance Modeling and Reduction for Wire-Bonded Half-Bridge SiC Multichip Power Modules
IEEE transactions on power electronics, 2021This article first developed an inductance model that includes the parasitic mutual inductance between parallel current path segments for SiC multichip power modules.
Boyi Zhang, Shuo Wang
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IEEE Journal of Emerging and Selected Topics in Power Electronics, 2022
Electric field stress concentration is one of the causes of partial discharge (PD) in power modules, which threatens the power modules’ safe operation. Herein, this article investigates the influences of temperature (from 150 to $250~^{\circ }\text{C}$ )
Ying Lin +7 more
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Electric field stress concentration is one of the causes of partial discharge (PD) in power modules, which threatens the power modules’ safe operation. Herein, this article investigates the influences of temperature (from 150 to $250~^{\circ }\text{C}$ )
Ying Lin +7 more
semanticscholar +1 more source
IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021
In renewable energy and grid applications, solder-attached power modules are subject to fatigue stress cycles of low amplitudes, but the devices will be in service for decades.
Borong Hu +5 more
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In renewable energy and grid applications, solder-attached power modules are subject to fatigue stress cycles of low amplitudes, but the devices will be in service for decades.
Borong Hu +5 more
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A New Package for SiC Power Modules with Ceramic Heatsink
European Conference on Cognitive Ergonomics, 2022Today, SiC devices are adopted more and more in various applications. Though SiC material has better thermal conductivity than Si material, effectively dissipating the heat through the power module can also significantly improve the thermal performance ...
Zhaobo Zhang, Xibo Yuan, Lihong Xie
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Selective Gate Driving in Intelligent Power Modules
IEEE transactions on power electronics, 2021Due to practical limitations in the manufacturing of power semiconductor dies, high power modules are composed of several dies in parallel in order to meet the desired load current requirements. With careful attention to the design, modern insulated gate
J. Brandelero, J. Ewanchuk, S. Mollov
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IEEE transactions on power electronics, 2021
Despite the rapid progression of silicon carbide (SiC) power devices, the thermal characteristic evaluation during power cycling at high temperature (>200 °C) is an issue.
Dongjin Kim +8 more
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Despite the rapid progression of silicon carbide (SiC) power devices, the thermal characteristic evaluation during power cycling at high temperature (>200 °C) is an issue.
Dongjin Kim +8 more
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Heat-Flux-Based Condition Monitoring of Multichip Power Modules Using a Two-Stage Neural Network
IEEE transactions on power electronics, 2021Power semiconductor chips are paralleled in modules to increase current rating. Under thermo-mechanical stresses in service, the die-attach solder layers will gradually develop into different levels of degradation.
Borong Hu +9 more
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