Results 281 to 290 of about 8,306,367 (352)

On power-associative modules

Journal of Algebra and Its Applications, 2022
The aim of this paper is to study the structure of irreducible modules in the variety [Formula: see text] of commutative power-associative nilalgebras of nilindex [Formula: see text]. If [Formula: see text] with dimension at most 5, then we prove that [Formula: see text] is contained in the annihilator of every irreducible [Formula: see text]-module ...
J. C. Gutierrez Fernandez, A. Grishkov, E. O. Quintero Vanegas   +2 more
openaire   +1 more source

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

IEEE transactions on power electronics
A proper thermal network model (TNM) facilitates the thermal analysis of multichip power modules and is beneficial to the reliability evaluation of power converters.
Huimin Wang, Zongyao Zhou, Zhiliang Xu, X. Ge, Yongheng Yang, Yi Zhang, Bo Yao, Dong Xie   +7 more
semanticscholar   +1 more source

State-of-the-Art Medium- and High-Voltage Silicon Carbide Power Modules, Challenges and Mitigation Techniques: A Review

IEEE Transactions on Components, Packaging, and Manufacturing Technology
Silicon carbide (SiC) power modules have been demonstrated potential for improving power density and efficiency for low-voltage (LV) power electronics systems.
Yang Li, .. Mustafeez-ul-Hassan, A. Mirza, Yang Xie, Shiyue Deng, Sama Salehi Vala, F. Luo, Xuhui Feng, S. Narumanchi, J. Flicker   +9 more
semanticscholar   +1 more source

Discrete Power Devices and Power Modules

2016
Methods devoted to electrothermal simulation are presented as a useful tool for both the analysis and characterization of behavior of power semiconductor devices standing alone, and/or coupled in integrated circuits or power modules. First of all the implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM ...
Chvála A, Cristaldi D, Donoval D, Greco G, Marek J, Molnár M, Príbytný P, RACITI, Angelo, Vinci G.   +8 more
openaire   +2 more sources

Combined geometrical techniques and applying nonlinear field dependent conductivity layers to address the high electric field stress issue in high voltage high-density wide bandgap power modules

IEEE transactions on dielectrics and electrical insulation, 2020
Wide bandgap (WBG) power modules made from materials such as SiC and GaN (and soon Ga2O3 and diamond), which can tolerate higher voltages and currents than Si-based modules, are the most promising solution for reducing the size and weight of power ...
M. Tousi, M. Ghassemi
semanticscholar   +1 more source

Finite Element and Experimental Analysis of Spacer Designs for Reducing the Thermomechanical Stress in Double-Sided Cooling Power Modules

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020
This article addresses the role of metal spacer design in reducing the thermomechanical stress of solder joint in automotive double-sided cooling power electronics modules.
Jaejin Jeon, Jihwan Seong, Jangmuk Lim, Min Ki Kim, Taehwa Kim, S. Yoon   +5 more
semanticscholar   +1 more source

Characterization of Nonlinear Field-Dependent Conductivity Layer Coupled With Protruding Substrate to Address High Electric Field Issue Within High-Voltage High-Density Wide Bandgap Power Modules

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020
In addition to higher blocking voltages of wide bandgap (WBG) power modules, their volume has been targeted to be several times smaller than that of Si-based modules.
M. Tousi, M. Ghassemi
semanticscholar   +1 more source

Common-Mode EMI Noise Analysis and Reduction for AC–DC–AC Systems With Paralleled Power Modules

IEEE transactions on power electronics, 2020
In this article, the common-mode (CM) noise model is developed for an ac–dc–ac system with paralleled power modules. The CM noise contributions from both rectifiers and motor drives are analyzed.
Le Yang, Hui Zhao, Shuo Wang, Yongjian Zhi   +3 more
semanticscholar   +1 more source

Microwave Modulator Requiring Minimum Modulation Power

IRE Transactions on Microwave Theory and Techniques, 1962
A microwave modulator was devised which requires a minimum of modulation power and which has very high modulation efficiency. The modulator functions as a switch, which opens and closes a transmission line proportional to a time function which represents information in digital form. The modulator is a varactor diode operating in the reverse bias region.
E.M. Rutz, E. Kramer
openaire   +1 more source

Real-Time Monitoring of Thermal Response and Life-Time Varying Parameters in Power Modules

IEEE transactions on industry applications, 2020
This article introduces new technologies for monitoring thermal response and life-time varying parameters of power electronic modules in real time without interrupting normal converter operation.
Christoph H. van der Broeck, Timothy A. Polom, R. Lorenz, R. D. De Doncker   +3 more
semanticscholar   +1 more source